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Compounds for photoresist stripping

A technology of photoresist and quaternary ammonium compound, which is used in the field of compounds for stripping photoresist, can solve the problems of unsatisfactory production and less precise removal, and achieve the effect of improving cleaning effect and cleaning performance

Inactive Publication Date: 2010-09-22
EKC TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

This means that compositions that have been suitable for cleaning and removing less delicate integrated circuit substrates in the past may not produce satisfactory results for substrates that contain more advanced integrated circuits in the manufacturing process

Method used

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  • Compounds for photoresist stripping
  • Compounds for photoresist stripping
  • Compounds for photoresist stripping

Examples

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Embodiment Construction

[0070] Photoresist polymers are often difficult to dissolve in cleaning compositions, many of which contain quaternary ammonium compounds and solvents. In most cases, chunks of polymer (if completely removed) lifted and were washed away from the substrate. Even under conditions of elevated temperature and prolonged contact time, simple quaternary ammonium compound / solvent mixtures are not chemically active enough to destroy tough polymers.

[0071] Applicants have discovered a composition for removing photoresist polymer and post-etch residue from substrates, the novel composition comprising hydroxylamine or hydroxylamine derivatives, quaternary ammonium compounds and at least one polar organic solvent. Such compositions increase the ability of the compound to dissolve the polymer. Hydroxylamine or hydroxylamine derivatives can also stabilize the quaternary ammonium compound and thus extend the cell life of the compound.

[0072] The compositions of the present invention e...

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Abstract

A composition for removing undesired matter from a substrate, the composition comprising hydroxylamine or a hydroxylamine derivative, a quaternary ammonium compound and at least one polar organic solvent. The composition is capable of removing photoresist from wafer level packaging and solder bumping applications.

Description

[0001] This application claims priority to US Provisional Application No. 61 / 001,053, filed October 31, 2007, which is hereby incorporated by reference in its entirety. technical field [0002] The present invention generally relates to cleaning compositions for removing photoresist polymers from substrates including metal and / or metal alloy portions and layers. The present invention is useful for stripping photoresist polymers (including but not limited to ion implantation photoresists) in wafer level packaging and solder bumping processes. Background technique [0003] The production of semiconductor integrated circuits typically involves extremely complex, time-consuming and expensive processes that must be done with ever-increasing precision as linewidth requirements continue to narrow. In the production process of semiconductors and semiconductor microcircuits, the substrate for making said semiconductors and microcircuits must be coated with a layer of organic polymer ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/20
CPCG03F7/425G03F7/426
Inventor X·C·尚
Owner EKC TECH
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