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Mold release agent composition for thermocompression molding and process for producing board

A technology of hot press forming and release agent, which is applied in the field of plate manufacturing, can solve the problems of difficult manufacturing performance and failure to meet the requirements, and achieve excellent secondary processability and high productivity.

Active Publication Date: 2010-09-08
MITSUI CHEM & SKC POLYURETHANES INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Some factories are trying to use organic isocyanate in the inner layer that does not come into contact with the hot plate, and use the existing formaldehyde-based adhesive on the inner and outer parts that are in contact with the hot plate. It is hard to say that it is practical in terms of manufacturing and performance

Method used

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  • Mold release agent composition for thermocompression molding and process for producing board
  • Mold release agent composition for thermocompression molding and process for producing board
  • Mold release agent composition for thermocompression molding and process for producing board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0075] In Example 1, the manufacture and thermal stability of the release agent composition of the present invention will be described together with Comparative Examples.

[0076] (Preparation of polyester compound)

[0077] Mix polyhydric alcohol, dibasic acid, and saturated fatty acid with the contents in Table 1, use tetra-n-butyl orthotitanate as a catalyst, and make it react at a reaction temperature of 160-200° C. and a reaction time of 8-10 hours to obtain the compounds listed in Table 1. Polyester compounds 1-4 of the present invention are shown. The viscosity and number average molecular weight of the polyester compound were measured, and the results are shown in Table 1.

[0078] In addition, the situation of polyester compound 5 used for comparison is also shown in Table 1.

[0079] (test methods)

[0080] Viscosity...Viscosity at 120°C based on JIS K6662

[0081] Number average molecular weight: Molecular weight in terms of monodisperse polystyrene by gel perme...

Embodiment 2

[0097] Panels were produced using the release agent composition produced in Example 1. Hereinafter, an example thereof will be described.

[0098] (board manufacturing conditions)

[0099] The production conditions of the board for performance evaluation will be described below.

[0100] Raw materials: fine chips (sawdust-like wood chips for the surface layer), strip-shaped chips (strip-like wood chips for the core layer), and brown asbestos are adjusted to a moisture content of 3% respectively

[0101] Set thickness: 18mm

[0102] Hot pressing temperature: 210°C

[0103] Pressurized pressure: 3.0MPa

[0104] Pressurization time: 4 minutes

Embodiment 2-1

[0106] Weigh an organic polyisocyanate (trade name Cosmonate M-50W manufactured by Mitsui Takeda Chemical Co., Ltd.) in an amount of 10% relative to the solid content of the fine chips, and mix the moisture content of the slab (mat) with respect to the solid content of the fine chips. Water in an amount up to 12%, and a release agent in an amount of 0.3% as an internal release agent based on the active ingredients of the release agent composition obtained in Example 1-2 were sprayed using a spray gun. on fine crumbs in a blender. Weigh the sprayed shavings so that the board density after molding is 0.75, so that it can be evenly molded to a size of 40cm×40cm on a steel tray, which is uniformly used as an external release agent on a tray at 150°C in advance. It is obtained by applying the release agent composition obtained in Example 1-1 and cooling it; and then covering the steel tray, and performing hot pressing under the above-mentioned plate manufacturing conditions, and th...

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Abstract

A mold release agent composition, or adhesive, capable of permanent mold release of a board containing any of lignocelluloses and an inorganic material easily from a hot platen in thermocompression molding, excelling in not only mold release capability and productivity but also heat resistance realizing an extremely low possibility of thermal deterioration on the hot platen; and a process for producing therewith a board through thermocompression molding of a molding material containing any of lignocelluloses, which board excels in secondary processability, water absorption swell ratio and flexural modulus. The mold release agent compositionis characterized by containing (I) polyester compound produced through reaction of (A) polyhydric alcohol, (B) dibasic acid and (C) saturated fatty acid in a molar proportion such that (A):(B):(C) = 1 : 0.5 to 1 : 2 to 3 and (II) low-density polyethylene in a weight ratio such that (I):(II) = 1:4 to 4:1.

Description

technical field [0001] The present invention relates to a release agent composition comprising a polyester compound obtained by reacting a dibasic acid, a polyhydric alcohol, and a saturated fatty acid as an essential component, and an adhesive composed of the release agent composition and an organic polyisocyanate compound. It relates to a method of manufacturing a panel formed by hot pressing using the release agent composition. Background technique [0002] It has been used as particle board, waffle board, OSB, insulation board, hard board, Medium Density Fiber Board, or rice husk board obtained by molding rice husk or It is widely used as an adhesive or binder for hot press molding of lignocellulosic boards such as sorghum boards obtained by molding sorghum stalks, and inorganic boards (hereinafter referred to as boards) made of inorganic materials. Thermosetting urea resin, melamine resin, urea melamine resin, melamine urea resin, phenolic resin, melamine phenolic resi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09K3/00B27N3/00B29C33/62C09J11/08C09J175/00C10M107/04C10M107/32C10M173/02C10N20/00C10N20/02C10N20/04C10N30/08C10N40/36
CPCB29C33/62C08G18/70B27N3/083C08G2150/50C08L67/02C08L23/06C08G2150/60C08L23/04C08L2666/20C08L2666/06
Inventor 伊藤武志田口新山县将松本浩
Owner MITSUI CHEM & SKC POLYURETHANES INC
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