LED lamp with lens injected with fluorescent glue and packaging method thereof

Abstract

The invention discloses an LED lamp with a lens injected with fluorescent glue and a packaging method thereof. The LED lamp consists of an LED chip, a base, packaging glue, the fluorescent glue and the lens, wherein the LED chip is fixed on the base, the lens covers the LED chip, a cavity for containing the packaging glue is formed between the lens and the base, the interior of the lens is provided with a cavity layer in which the fluorescent glue can be filled, and the lens is also provided with a glue-injecting hole; the LED chip is covered by the solidified packaging glue which is injected into the cavity via the glue-injecting hole, and the solidified fluorescent glue is injected into the cavity layer via the glue-injecting hole. The unique method for processing the fluorescent glue can ensure that the fluorescent glue can be uniformly coated, consequently, the light spot of the LED is uniform, and the consistency of color is good. Meanwhile, since the packaging glue partitions the fluorescent glue from the chip, when the chip gets hot, heat cannot attenuate the performance of fluorescent powder, and the service life of the LED can be prolonged.

Description

technical field [0001] The invention relates to a LED Light Emitting Diode (LED Light Emitting Diode) packaging technology, in particular to an LED lamp in which fluorescent glue is injected into a lens cavity and a packaging method thereof. Background technique [0002] At present, the main method of making white LED lamps is to coat yellow phosphor powder on the surface of blue LED chips, which is excited by blue light to emit yellow light, which is mixed with transmitted blue light to present white light. There are mainly two traditional packaging methods for high-power LEDs, one is molded lens injection, and the other is lens molding. [0003] The molding lens glue injection process is to first solidify the crystal and wire, then apply fluorescent glue on the surface of the LED chip, then cover the lens, then inject glue into the lens, and finally cure and shape. [0004] The lens compression molding process is to form the lens during the packaging process, figure 2 In...

AI Technical Summary

Problems solved by technology

[0005] The above two LED lamp packaging methods are based on the glue dispensing process, which is to put the fluorescent glue in a small container, control the amount of glue by controlling the glue out time, and finally rely on the glue's own flow and surface tension. Molding, this method cannot control the consistency of the thickness of the fluorescent glue layer wrapped on the top and around the wafer, resulting in different thicknesses of the fluorescent glue directly above and around the wafer, the chip emits light at 180°, and the light emitted by the chip is directed to different thicknesses. When the same fluorescent glue is used, the color uniformity of the packaged LED lights will vary greatly.

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