Method for manufacturing circuit board through injection molding

Abstract

The invention discloses a method for manufacturing a circuit board through injection molding, which comprises the following steps of: a, performing injection molding and extruding on plastics by using a mold provided with a circuit pattern to form a substrate consisting of a convex part, a downwards concave part and a through hole and a groove, wherein the downwards concave part is the circuit pattern of the circuit board, and the convex part is a non-conductive part; b, performing coarsened copper plating, copper plating or nickel and aurum plating to the needed thickness on the substrate; c, grinding the convex part by using grinding equipment, removing the metal of the convex part, and forming a complete conductive circuit pattern on the metal layer of the remained downwards concave part; and d, performing solder mask, molding and testing by the conventional method for manufacturing the printed circuit boards, and forming the circuit board product. In the method, a copper-clad plate is not taken as the substrate, and the method has simple manufacturing technology, saves materials, has low production cost and no waste emission, and is favorable for environmental protection.

Description

technical field [0001] The present invention relates to a printed circuit board (PCB), in particular to a method for making a circuit board directly by injection molding without using a copper-clad laminate as a substrate. Background technique [0002] As we all know, printed circuit board (PCB) is widely used as the basic material of electronics industry. As small as electronic watches, calculators, personal computers, as large as computers, communication equipment, medical equipment, and aerospace or military equipment, as long as there are electronic components such as integrated circuits, PCBs are used for electrical interconnection between them. Printed circuit boards are formed by setting conductive patterns for electrical connections between electronic components on an insulating substrate, and its manufacturing process is relatively complicated. In the decades since the invention of the printed wiring board, although the method of making it has continued to improve,...

AI Technical Summary

Problems solved by technology

The process links are many and complicated, and the required machinery and equipment are many and the cost is high. The production consumes a lot of natural resources and produces a lot of waste water, waste gas and solid waste, causing serious pollution to the environment.