Process for constructing insulating wall by adhering polyphenyl plates, filling polyurethane and spreading plaster in a combing way
A technology of thermal insulation wall and construction technology, applied in thermal insulation, building components, covering/lining, etc., can solve the problems of shortening the service life of the wall thermal insulation layer, freezing and thawing, cracking, etc., to improve the thermal insulation effect of the wall and prolong the use. Years, the effect of increasing the bonding area
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Examples
Embodiment 1
[0011] Example 1: A polystyrene board, plastering layer compound pouring polyurethane insulation wall construction process, (1), base wall treatment, the surface of the building wall is treated, so that the insulation layer can be reliably fixed on the base wall Materials; (2) On the base wall, the polystyrene boards are pasted with adhesives by point bonding method or full bonding method to ensure that there is a 10mm wide gap reserved between adjacent polystyrene boards, and at the same time ensure that the joints A distance of 10mm is reserved between the outer edge and the surrounding edges of the polystyrene board (when the spot bonding method is used, the outer edge of the outermost sticking point is reserved for 10mm from the surrounding edge of the polystyrene board; when the full bonding method is used, the distance between the outer edge of the bonding surface and the polystyrene board Reserve 10mm around the edges); (3) When the bonding strength of the adhesive betwe...
Embodiment 2
[0012] Embodiment 2: The difference from Embodiment 1 is that a gap of 50 mm wide is reserved between adjacent polystyrene boards, and a distance of 20 mm is reserved between the outer edge of the joint and the surrounding edges of the polystyrene board, and polyurethane hard foam is added. The width to improve the bonding strength and enhance the thermal insulation performance.
Embodiment 3
[0013] Embodiment 3: The difference from Embodiment 1 is that a 100mm wide gap is reserved between adjacent polystyrene boards, and a distance of 30 mm is reserved between the outer edge of the bonding place and the surrounding edges of the polystyrene board, and polyurethane hard foam is added. The width to improve the bonding strength and enhance the thermal insulation performance.
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com