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Fluorescent powder packaging of light-emitting diode

A technology of light-emitting diodes and packaging methods, which is applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve problems such as uneven color, unstable quality, and inability to accurately control the fluorescent cube of phosphor powder, etc., to simplify the packaging process, The effect of high color uniformity

Inactive Publication Date: 2012-06-06
NAT CENT UNIV
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In order to solve the above-mentioned fluorescent powder packaging technology by coating or dispensing on the LED chip, there will be fluorescent powder cubes that cannot be controlled very accurately, resulting in shortcomings such as unstable quality and uneven color; therefore, the present invention provides Phosphor powder packaging method for light-emitting diode

Method used

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  • Fluorescent powder packaging of light-emitting diode
  • Fluorescent powder packaging of light-emitting diode
  • Fluorescent powder packaging of light-emitting diode

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Embodiment Construction

[0017] In order to facilitate your examiners to have a further understanding of the technical means and operation process of the present invention, an embodiment is now given with the accompanying drawings, and the detailed description is as follows.

[0018] The present invention is a kind of fluorescent powder encapsulation method of light-emitting diode, because the coating shape, concentration and uniformity of fluorescent powder have great influence on the quality (such as: light extraction efficiency, color temperature and color uniformity) of white light emitting diode (Light Emitting Diode, referred to as LED). Degree, etc.) have a great influence, therefore, in order to accurately control the parameters such as the position, shape, size, concentration, uniformity and thickness of the light-emitting diode when the phosphor is packaged, the present invention provides the phosphor of the light-emitting diode shown below Packaging process, its processing steps refer to fi...

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Abstract

The invention discloses a fluorescent powder packaging process of a light-emitting diode, which comprises the steps of producing a transparent optical material lens, and forming at least one fluorescent powder accommodating slot which corresponds to a light-emitting diode chip on one surface of the lens; adjusting the concentration, and attaching fluorescent powder in the fluorescent powder accommodating slot according to the required quantity; and baking for curing the fluorescent powder; filling a gap between the light-emitting diode chip with well wire bonding and the fluorescent powder lens with colloid, and carrying out mutual bonding, thereby completing the fluorescent powder packaging process. The process can effectively and precisely dominate the fluorescent powder, and achieve the advantages of excellent quality stability, color uniformity and the like.

Description

technical field [0001] The invention relates to a fluorescent powder packaging of a light-emitting diode, in particular to a production process for changing the fluorescent powder packaging technology of a light-emitting diode. Background technique [0002] In 1996, Nichia Chemical Corporation of Japan developed the Ce-doped Yttrium Aluminum Garnet phosphor material (Ce-doped Yttrium Aluminum Garnet) that uses indium gallium nitride blue light emitting diode (Light Emitting Diode, LED for short) chip to match yellow light with cerium as the light emitting center. , referred to as YAG: Ce) to obtain a white light source, which is the prelude to the white LED entering the lighting market. Compared with traditional light sources, white LEDs have the advantages of energy saving and environmental protection, and are in line with the development trend of global green lighting. Therefore, improving the quality stability and color uniformity of LEDs is the goal of all walks of life....

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/00
Inventor 孙庆成马仕信李宗宪
Owner NAT CENT UNIV
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