Density sensor chip based on micro electro mechanical system technology and preparation method thereof
A technology of micro-electromechanical systems and density sensors, which is applied to components of TV systems, microstructure technology, generators/motors, etc., can solve problems such as high density measurement errors, corrosion of aluminum leads, uneven distribution, etc., and achieve development Low heat, high sensitivity, high sensitivity effect
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[0027] The structure, preparation method and working principle of the present invention will be described in more detail below in conjunction with the accompanying drawings.
[0028] Such as figure 1 , figure 2 As shown, the cantilever beam type density sensor chip provided by the present invention is a trapezoidal silicon micro-cantilever beam structure chip based on the vibration principle, comprising two layers of monocrystalline silicon 16, 19 and a silicon dioxide layer arranged between the two layers of monocrystalline silicon 17. The upper single crystal silicon 16 includes a resistance layer 14, and the surface of the upper single crystal silicon 16 is arranged with a silicon nitride stress matching layer 11, a titanium-platinum-gold beam lead 10, a silicon nitride shielding layer 12, a silicon dioxide Protective layer 13 and silicon nitride protective layer 15, titanium-platinum-gold beam-type flying leads 9 are arranged on the silicon nitride shielding layer 12, an...
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