Production method of bright-copper-face high-heat-conductivity ceramic circuit board capable of locating
A technology of high thermal conductivity ceramics and production methods, which is applied in the direction of removing conductive materials by chemical/electrolytic methods, printed circuits, and printed circuit manufacturing. It can solve problems such as unsatisfactory thermal conductivity, poor dimensional stability, and complicated processing technology. Achieve the effect of good heat conduction and heat dissipation, good surface compactness and simple processing technology
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Embodiment 1
[0033] A kind of bright copper surface of the present invention and can locate the production method of high thermal conductivity ceramic circuit board, it comprises the following steps:
[0034] a. Pretreatment of the substrate
[0035] Mainly include: incoming material inspection → degreasing → pickling → electroplating copper → cleaning → drying and other processes;
[0036] The specific method is: clean the surface of the qualified ceramic copper-clad substrate, use sodium persulfate to micro-etch the copper-clad layer of the ceramic copper-clad substrate, and remove the oil stains and surface oxides on the copper-clad layer, which is relatively It is more effective to prevent damage to the ceramic copper-clad substrate when using physical methods to clean the circuit board substrate, because the physical method is generally to first press the substrate tightly, and then use the roller brush to rotate at high speed on its surface, and the substrate is cleaned by the roller...
Embodiment 2
[0057] A kind of bright copper surface of the present invention and can locate the production method of high thermal conductivity ceramic circuit board, it comprises the following steps:
[0058] a. Pretreatment of the substrate
[0059] Mainly include: incoming material inspection → degreasing → pickling → electroplating copper → cleaning → drying and other processes;
[0060] The specific method is to clean the surface of the qualified ceramic copper-clad substrate. The specific method is to use sodium persulfate to micro-etch the copper-clad layer of the ceramic copper-clad substrate to remove oil stains and surface oxides on the copper-clad layer. , which is more effective in preventing damage to the ceramic copper-clad substrate than using physical methods to clean the circuit board substrate, because the physical method generally first compresses the substrate, and then uses a roller brush to rotate at high speed on its surface. The brush rubs against the surface of the...
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