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Method for plating thick gold layer in circuit board manufacturing process

A circuit board production, circuit board technology, applied in the direction of printed circuit manufacturing, printed circuit, electrical components, etc., can solve the problems of poor electroplating resistance, easy permeation plating, difficult to control gold, etc., to achieve good surface treatment and good electroplating resistance , the effect of surface treatment without pollution

Inactive Publication Date: 2010-01-20
深圳市九和咏精密电路有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] At present, the commonly used circuit board printing is to use a nickel-gold sealing oil plating thick gold technology, such as figure 1 As shown, the main steps are primary nickel gold, double-sided wet film sealing, gold plating pretreatment, and thick gold plating, wherein, a) primary nickel gold plating is formed in a plating solution containing halogen elements, containing halogen elements The plating solution pollutes the environment; b), the double-sided wet-sealed film has poor electroplating resistance and is easy to bleed as the gold thickness increases; c), as the double-sided wet-sealed film is extended with the gold-plating time, the wet film dissolves liquid, pollute the gold tank, making it difficult to control the gold in the gold plating process; d), the pre-treatment of thick gold plating is brushed, so there is a phenomenon of wet film falling off

Method used

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  • Method for plating thick gold layer in circuit board manufacturing process
  • Method for plating thick gold layer in circuit board manufacturing process

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0049] Embodiment 1, a kind of thick gold plating method in the circuit board manufacturing process comprises the following steps:

[0050] A. First, carry out chemical nickel-gold treatment on the circuit board with graphic tin plating, etching circuit lines, printing solder mask, immersion nickel layer, and immersion gold layer;

[0051] The graphic tin plating includes the following steps:

[0052] a1. Copper plating after drilling holes on the cut circuit board, wherein the circuit board is immersed in the copper plating solution for copper plating, and the copper plating solution CU 2+ The concentration is: 60 grams of CU per liter of solution 2+ , CL - : 40ppm, containing H in every 100 liters of solution 2 SO 4 8 liters;

[0053] b1. After copper plating, pre-treat the grinding plate, then print the wet film or paste the dry film, then bake the plate, align, expose and develop the wet film or dry film, and then produce graphics;

[0054] c1, and then copper electr...

Embodiment 2

[0081] Embodiment 2, a kind of thick gold plating method in circuit board manufacturing process, comprises the following steps:

[0082] A. First, carry out chemical nickel-gold treatment on the circuit board with graphic tin plating, etching circuit lines, printing solder mask, immersion nickel layer, and immersion gold layer;

[0083] The graphic tin plating includes the following steps:

[0084] a1. Copper plating after drilling holes on the cut circuit board, wherein the circuit board is immersed in the copper plating solution for copper plating, and the copper plating solution CU 2+ The concentration is: 80 grams of CU per liter of solution 2+ , CL - : 80ppm, every 100 liters of solution contains H 2 SO 4 10 liters;

[0085] b1. After copper plating, pre-treat the grinding plate, then print the wet film or paste the dry film, then bake the plate, align, expose and develop the wet film or dry film, and then produce graphics;

[0086] c1, and then copper electroplatin...

Embodiment 3

[0113] Embodiment 3, a kind of thick gold plating method in the circuit board manufacturing process comprises the following steps:

[0114] A. First, carry out chemical nickel-gold treatment on the circuit board with graphic tin plating, etching circuit lines, printing solder mask, immersion nickel layer, and immersion gold layer;

[0115] The graphic tinning includes the following steps:

[0116] a1. Copper plating after drilling holes on the cut circuit board, wherein the circuit board is immersed in the copper plating solution for copper plating, and the copper plating solution CU 2+ The concentration is: 70 grams of CU per liter of solution 2+ , CL - : 60ppm, containing H in every 100 liters of solution 2 SO 4 12 liters;

[0117] b1. After copper plating, pre-treat the grinding plate, then print the wet film or paste the dry film, then bake the plate, align, expose and develop the wet film or dry film, and then produce graphics;

[0118] c1, and then copper electropl...

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Abstract

The invention discloses a method for plating a gold thick layer in a circuit board manufacturing process, which comprises the following steps of: A, firstly, subjecting a circuit board to pattern tin plating, circuit wire etching, solder-mask printing and chemical nickel and gold processing treatments of depositing a nickel layer and depositing a gold layer; B, carrying out the anti-oxidation post treatment of the circuit board subjected to the chemical nickel and gold processing treatments; C, covering a non-gold plated area of the circuit board; and D, after pre-treating the surface of the circuit board, plating the thick gold layer on a lead of the circuit board by a post drawing process. The invention provides a method for plating thick gold layer in the circuit board manufacturing process, which has advantages of pollution prevention, environment protection, gold salt conservation, good quality and easily controllable gold color.

Description

technical field [0001] The invention relates to a method for plating gold on a circuit board, in particular to a method for plating thick gold in the process of making a circuit board. Background technique [0002] At present, the commonly used circuit board printing is to use a nickel-gold sealing oil plating thick gold technology, such as figure 1 As shown, the main steps are primary nickel gold, double-sided wet film sealing, gold plating pretreatment, and thick gold plating, wherein, a) primary nickel gold plating is formed in a plating solution containing halogen elements, containing halogen elements The plating solution pollutes the environment; b), the double-sided wet-sealed film has poor electroplating resistance and is easy to bleed as the gold thickness increases; c), as the double-sided wet-sealed film is extended with the gold-plating time, the wet film dissolves The liquid pollutes the gold cylinder, making it difficult to control the gold color in the gold pl...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00
Inventor 苏云
Owner 深圳市九和咏精密电路有限公司
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