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Method for preparing through-hole foam copper

A technology of foamed copper and electrolytic copper powder, applied in the field of metal manufacturing, to achieve uniform pore size and pore distribution, reduce scrap rate, and high sintering quality

Inactive Publication Date: 2011-06-22
HEBEI UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, so far there are few reports on the application of this method to prepare foamed copper, especially the use of NaCl (the melting point of NaCl is 801°C) as a pore-forming agent that is easy to desolvate but has a melting point significantly lower than the usual copper sintering temperature > 900°C. see

Method used

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  • Method for preparing through-hole foam copper
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  • Method for preparing through-hole foam copper

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] The first step is to carry out decrystallization water treatment on commercially available NaCl particles, and use a standard sample sieve to sieve particles of different particle sizes;

[0031] In the second step, the NaCl particles with an average particle size of 0.2mm obtained from the first step of treatment and sieving are evenly mixed with commercially available electrolytic copper powder and ethanol, then loaded into a pressing mold, and unidirectionally pressurized to 250MPa to obtain a green body , the mass of the electrolytic copper powder and NaCl particles is given by m 铜 =V×(1-P)×8.96, m NaCl =V×P×2.16 is determined, wherein V is the volume of foamed copper, P is the porosity, and 8.96 and 2.16 are the densities of electrolytic copper and NaCl in a dense state respectively; the addition of ethanol is 2% of the total mass of electrolytic copper powder and NaCl %;

[0032] In the third step, the green body obtained in the second step is placed in an argon...

Embodiment 2

[0035] The first step is to carry out decrystallization water treatment on commercially available NaCl particles, and use a standard sample sieve to sieve particles of different particle sizes;

[0036]In the second step, the NaCl particles with an average particle size of 0.75mm obtained from the first step of treatment and sieving are evenly mixed with commercially available electrolytic copper powder and propanol, then loaded into a compression mold, and pressurized to 300MPa in one direction to obtain a raw material. billet, the mass of the electrolytic copper powder and NaCl particles is given by m 铜 =V×(1-P)×8.96, m NaCl =V×P×2.16 is determined, wherein V is the volume of foamed copper, P is the porosity, 8.96 and 2.16 are respectively the densities of electrolytic copper and NaCl in a dense state; the addition of propanol is the total mass of electrolytic copper powder and NaCl 3%;

[0037] In the third step, the green body obtained in the second step is placed in an ...

Embodiment 3

[0042] The first step is to carry out decrystallization water treatment on commercially available NaCl particles, and use a standard sample sieve to sieve particles of different particle sizes;

[0043] In the second step, the NaCl particles with an average particle size of 3mm obtained from the first step of treatment and sieving are evenly mixed with commercially available electrolytic copper powder and acetone, then loaded into a pressing mold, and unidirectionally pressurized to 300MPa to obtain a green body. The quality of described electrolytic copper powder and NaCl particle is by m 铜 =V×(1-P)×8.96, m NaCl =V × P × 2.16 is determined, wherein V is the volume of foamed copper, P is the porosity, 8.96 and 2.16 are respectively the densities of electrolytic copper and NaCl in a compact state; the addition of acetone is 4% of the total mass of electrolytic copper powder and NaCl %;

[0044] In the third step, the green body obtained in the second step is placed in an argo...

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Abstract

The invention relates to a method for preparing through-hole foam copper, in particular to the manufacture of metal with an opened or a closed hole. Electrolytic copper powder and NaCl granules are taken as raw materials, and sintering-desolvation technology is adopted for preparing the through-hole foam copper; the NaCl granules, the electrolytic copper powder and additive are evenly mixed together and then pressed into green-ware; the obtained green-ware is sintered in a sintering furnace under the argon atmosphere, and the obtained product is placed into a circulating hot water device to dissolve and remove the NaCl granules and then washed by ultrasonic wave water bath, and cleaned by acetone; finally, the through-hole foam copper product which is provided with the hole formed by three-dimensional communicated space network, has the porosity of 50-81% and the average pore size of 0.2-4mm and is provided with microcosmic holes in a base body can be obtained. The obtained through-hole foam copper has controllable porosity and aperture, higher sintering quality and excellent energy absorbing performance.

Description

technical field [0001] The technical solution of the invention relates to the manufacture of metals with open or closed pores, in particular a method for preparing through-hole foamed copper. Background technique [0002] Through-hole copper foam has the characteristics of high specific surface area, sound absorption, penetration, filtration and energy absorption, and has great market application potential in the fields of catalysis, chemical industry, energy, thermal energy, environmental protection, buffering, shock absorption and noise reduction. [0003] Regarding the preparation method of foam copper, the existing technologies that have been developed include: directional solidification method, electrodeposition or vapor deposition method and powder metallurgy method. Among them, the directional solidification method can prepare metal foams of various configurations, especially coral-shaped copper foams, but the porosity and open porosity are relatively low, so it is no...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C22C1/08
Inventor 王清周崔春翔陆东梅李诺
Owner HEBEI UNIV OF TECH
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