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Percolation efficiency of the conductivity of electrically conductive adhesives

A technology of conductive adhesive and conductive filler, applied in the field of conductive adhesive, which can solve the problems of high viscosity of conductive adhesive and increased contact resistance

Inactive Publication Date: 2013-02-13
THE HONG KONG UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this method may lead to an increase in contact resistance (due to the increase in contact points) and excessive viscosity of the conductive adhesive

Method used

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  • Percolation efficiency of the conductivity of electrically conductive adhesives
  • Percolation efficiency of the conductivity of electrically conductive adhesives
  • Percolation efficiency of the conductivity of electrically conductive adhesives

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0045] Example 1-Surface modification of conductive filler

[0046] 10 grams of micron-sized silver flakes (about 5.6 microns in diameter) were dispersed in 100 ml of ethanol solution (containing 0.02% by weight of iodine). The solution was slowly stirred and mixed for 30 minutes at room temperature. The solution was then filtered through filter paper, and the filter cake was washed 3 times with ethanol. The filter cake was vacuum dried at room temperature until it was completely dry.

[0047] Preparation of modified conductive adhesive: The following data is based on a silver-containing adhesive formulation with a silver content of 75% by weight. In fact, the content of conductive filler can be in a wide range by adjusting the ratio of filler weight and resin matrix.

[0048] Mix 8.2 grams of dry silver flakes with 1.5 grams of bisphenol A epoxy resin under high-speed stirring

[0049] (EPON 828) and 1.3 grams of methyltetrahydrophthalic anhydride (MTHPA) were mixed for 30 minute...

Embodiment 2

[0051] Example 2-Sodium chlorite surface modifier

[0052] The modified conductive adhesive was prepared using the same steps as in Example 1, but the surface modifier was sodium chlorite instead of iodine. 10 grams of micron-sized silver flakes (about 5.6 microns in diameter) were dispersed in 100 ml of ethanol solution (containing 0.02% by weight of sodium chlorite). The solution was slowly stirred at room temperature for 30 minutes. The solution was filtered through filter paper and the filter cake was washed 3 times with ethanol. After that, the filter cake was vacuum dried at room temperature until it was completely dry.

Embodiment 3

[0053] Example 3-Bromine surface modifier

[0054] The modified conductive adhesive was prepared using the same steps as in Example 1, but the modifier was bromine instead of iodine. 10 grams of micron-sized silver flakes (about 5.6 microns in diameter) were dispersed in 100 ml of ethanol solution (containing 0.025% by weight of bromine). The solution was slowly stirred at room temperature for 30 minutes. The solution was filtered through filter paper and the filter cake was washed 3 times with ethanol. After that, the filter cake was vacuum dried at room temperature until it was completely dry.

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Abstract

An electroconductive bonding material is formed as a Modified Electrically Conductive Adhesive (MECA), and consists of a resin matrix and a modified conductive filler. The resin matrix if formed by providing a thermosetting or thermoplastic resin-based polymer resin. The conductive filler is a metal filler material suitable for use as conductive filler for the resin matrix. The metal filler is modified by applying a material selected from one of halogens, pseudohalogens or their precursors.

Description

[0001] Related patent applications [0002] This patent application claims priority of US Provisional Patent Application No. 61 / 071,922 filed on May 27, 2008, which was filed by the inventor and incorporated herein by reference. Technical field [0003] The invention relates to a modified conductive adhesive (MECA) formed by mixing a surface-modified conductive filler and a resin matrix. By modifying the surface of the conductive filler, a thin layer of nanostructures containing partially oxidized metal halide or metal pseudohalide (pseudohalide) can be formed on the surface of the filler, which can improve the conductive filler after the MECA is cured. Conductivity. Background technique [0004] Over the years, due to the unique mechanical properties, processing characteristics, thermal properties, reliability and environmental friendliness of lead-free conductive adhesives, lead-free conductive adhesives have gradually replaced the widely used surface mount technology. Lead-cont...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J201/00C09J9/02C09J11/04C09J179/08C09J163/00C09J183/04C09J179/04C09C1/62C09C3/06C09C3/08
CPCH01B1/22H05K2203/125H05K3/321Y10T428/2991Y10T428/2998
Inventor 杨诚袁铭辉徐兵
Owner THE HONG KONG UNIV OF SCI & TECH
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