Semiconductor processing device and nozzle structure used in same
A processing device and semiconductor technology, applied in the direction of semiconductor/solid-state device manufacturing, spraying device, spraying device, etc., can solve the problems of increased design difficulty, increased design difficulty, small space, etc., achieve flexible design and optimization, and improve cutting Erosion uniformity, the effect of improving the excellent rate
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[0021] see image 3 , which shows a partial schematic diagram of a preferred embodiment of the present invention for a semiconductor processing device, which is provided with a nozzle (such as image 3 shown), for example, the nozzle is provided above the wafer in the etching equipment, image 3 Other structures of the semiconductor processing device are not shown in the figure, but these structures are well known or obvious to those skilled in the art. The nozzle includes a columnar body 1 with an inner diameter. Generally, the exterior of the body is also columnar, including cylinders or cylinders with polygonal cross-sections. The body 1 is also provided with a gas inlet 3 and a gas outlet 4 . Moreover, the gas inlet 3 is located on the upper edge of the body 1, the gas outlet 4 is located at the bottom of the side wall 10 of the body 1, and a Air flow channel 101, the air flow channel 101 communicates with the gas inlet 3 and the gas outlet 4, the air flow channel 101 of...
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