Method for designing and extending 808nm laser material by adopting (In)GaAs/GaAs straining isolated layer
A technology for isolation layers and lasers, applied to lasers, laser components, semiconductor lasers, etc., can solve problems such as the decline in output power slope efficiency, and achieve the effects of improving performance, improving overall performance, quantum efficiency and high temperature characteristics
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[0012] Such as figure 1 As shown, a structure of an 808nm semiconductor laser material that uses (In)GaAs / GaAs strain isolation layer to efficiently realize high efficiency and high temperature operation includes:
[0013] The substrate (1) has a (100) orientation and a Si doping concentration of 1 to 2×10 18 cm -3 GaAs crystal material, EPD≤100 -2 ; GaAs buffer layer (2), growth temperature 580 ° C, n (Si) doped 2 × 10 18 cm -3 , with a thickness of 1 μm thick;
[0014] Al 0.55 Ga 0.45 As lower cladding layer (3), n(Si) doped 3.0×10 17 cm -3 , 1.2 μm thick;
[0015] Al 0.4 Ga 0.6 As lower waveguide layer (4), 0.35 μm thick;
[0016] Introduce a layer of (In)GaAs / GaAs strain isolation layer (5) with 1 to 2 periods to increase the physical distance between the quantum well and the growth interface of the initial barrier layer and strengthen the reflection of electrons, and reduce the active area Accumulation of oxygen at the heterojunction interface with the wavegu...
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