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Method for improving optical power stability of semiconductor laser

A laser and stability technology, which is applied in the direction of semiconductor lasers, lasers, laser components, etc., can solve the problem that the solder cannot be deformed, and achieve the effects of stable optical power, improved stability, and cost savings

Active Publication Date: 2010-11-17
江苏飞格光电有限公司
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  • Abstract
  • Description
  • Claims
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Problems solved by technology

[0007] The technical problem to be solved by the present invention is to overcome the contradiction that the vacuum baking of the laser device needs high temperature to remove water vapor before the capping, and needs to satisfy the contradiction that the solder cannot be deformed before and after baking, and find a suitable baking temperature, baking time and baking time. Baking step, providing a method to improve the stability of optical power of semiconductor lasers

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  • Method for improving optical power stability of semiconductor laser

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Embodiment Construction

[0017] Method of the present invention can be realized on conventional capping machine, and the concrete steps of its embodiment are as follows:

[0018] ① Open the inlet and outlet door 1 of the capping machine and put the laser component into the vacuum oven 2 that comes with the capping machine;

[0019] ②Close the inlet and outlet door 1 of the capping machine;

[0020] ③ Vacuumize the vacuum oven 2 until the air pressure in the oven is 0.5 mm Hg;

[0021] ④ Fill dry nitrogen into the vacuum oven 2 that has been evacuated until the air pressure in the oven is 760 mm Hg;

[0022] ⑤ Vacuumize the vacuum oven 2 until the air pressure in the oven is 0.5 mm Hg;

[0023] ⑥ Fill the vacuum oven 2 with dry nitrogen until the air pressure in the oven is 760 mm Hg;

[0024] ⑦ Turn on the heating switch of the vacuum oven 2, set the heating temperature to 105 degrees Celsius, and the heating time to 16 hours;

[0025] 8. While performing step 7., maintain the air pressure in the ...

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Abstract

The invention belongs to manufacturing technology for semiconductor photoelectric devices, and relates to a method for improving the optical power stability of a semiconductor laser. The method is to roast and package laser components on a sealing machine, and comprises the following steps in turn: a, placing unpackaged laser components into a vacuum oven in the sealing machine; b, performing vacuum pumping on the vacuum oven and introducing dried nitrogen into the vacuum oven; c, repeating the step b for times; d, opening a heating switch of the vacuum oven, setting the heating temperature tobetween 100 and 110 DEG C and the heating time to between 12 and 18 hours, and maintaining the air pressure in the vacuum oven to less than 1 mmHg in the heating process; and e, introducing the driednitrogen into the vacuum oven after the heating is over until the air pressure is 760 mmHg, transferring vacuum roasted laser components into a sealed operation box, and completing the process of sealing the laser components. The method not only improves the optical power stability of the semiconductor laser but also shortens the vacuum roasting time and saves the cost.

Description

technical field [0001] The invention belongs to the manufacturing technology of semiconductor photoelectric devices, and relates to an improvement of semiconductor laser packaging technology, in particular to a method for improving the stability of semiconductor laser light power by improving the packaging technology. Background technique [0002] The stability of optical power is the basic requirement for semiconductor lasers. Internationally, there are also strict requirements on the water vapor content in the sealed components. While ensuring the stability of the optical power of the laser, it is also necessary to ensure that the water vapor content in the sealed components is lower than 5000ppm. It has become one of the difficulties in semiconductor packaging technology. [0003] The factors affecting the stability of optical power in the laser packaging process mainly include the following three aspects: [0004] 1. There are stresses in the materials inside the laser ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01S5/00
Inventor 李明
Owner 江苏飞格光电有限公司
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