Base metal nickel internal electrode slurry of microwave multiple-layer sheet ceramic capacitor

Abstract

The invention relates to base metal nickel internal electrode slurry of a microwave multiple-layer sheet ceramic capacitor, which comprises 40 to 50 of high-crystallinity nanometer nickel powder, 2 to 10 of yttrium oxide stable zirconia nanometer powder bodies and 40 to 58 of organic carriers according to the weight percentage, wherein the organic carriers comprise 2 percent to 6 percent of cellulosic resin and 38 percent to 52 percent of dihydroterpineol. Aiming at the stress problem of a metal part and a ceramic part of the microwave multiple-layer sheet ceramic capacitor, the invention can reduce the volume change caused by the phase change to reduce the internal stress, microcracks of a dielectric layer are reduced to increase the reliability of the microwave ceramic capacitor, and consequently, the microwave multiple-layer sheet ceramic capacitor can also use a base metal nickel electrode technology to replace the prior silver palladium noble metal technology. The invention saves social resources, greatly reduces the production cost and quickly realizes the industrialization.

Description

technical field [0001] The invention relates to a base metal nickel internal electrode slurry, in particular to a slurry using high crystallization nano-nickel powder and yttria-stabilized nano-zirconia powder as raw materials for making microwave multilayer chip ceramic capacitors. Background technique [0002] Traditional electronic pastes are generally conductive silver pastes, conductive palladium pastes, conductive gold pastes, resistive pastes and other precious metal pastes. However, in the past ten years, the low-cost base metal nickel conductive paste has developed rapidly, and its main application field is multilayer chip ceramic capacitors. With the miniaturization of the whole machine and the rapid increase of mobile electronic equipment, the development of multilayer chip ceramic capacitors is also extremely rapid. Traditional precious metal pastes are clearly beyond the reach of users in terms of cost. The multilayer chip ceramic capacitor with the base metal...

AI Technical Summary

Problems solved by technology

[0007] The above three Chinese patent applications all focus on solving the problem of layer cracking between layers, but they cannot effectively solve the problem of microcracks in the dielectric layer caused by the internal stress of microwave multilayer ceramic capacitors (non-layer cracking)

In fact, although the problem of cracking between layers has been solved, the more difficult stress problem of metal parts and ceramic body parts still needs to be solved in depth

This volume change caused by the phase change will inevitably lead to the long-term existence of internal stress, resulting in the generation of microcracks in the dielectric layer.

Judging from the above three patent formulas, this deeper problem and difficulty have not been considered.

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