Device and method for inner bore type component brush plating

Abstract

The invention provides a device and method for inner bore type component brush plating. The device comprises a workpiece to be plated, a workpiece clamping sealing device, a plating pen special for inner bore brush plating, and a plating pen rotary actuator. The workpiece to be plated and the clamping sealing device together form a container having an opening at the top; in plating process, the workpiece is the cathode, and the plating pen is the anode. The device and method realize that plating is prepared at the surface of the inner bore of the inner bore type component by using the technology of brush plating, thereby being applied to strengthening for new workpiece and also being applied to batch repair and remanufacturing for damaged pieces.

Description

Device and method for electro-brush plating of inner hole parts technical field The invention relates to an electric brush plating technology, in particular to a device and method for inner hole electric brush plating. This method is aimed at parts with inner holes, and it is not only suitable for strengthening new parts, but also for repairing and remanufacturing of worn parts. Background technique Brush plating is a surface processing technology that uses electrochemical methods to reduce metal ions to metal and deposit them on the surface of metal or non-metal products to form a smooth and dense metal coating that meets the requirements. With the development of science and technology and production, brush plating technology involves more and more fields, and people's requirements for coating are getting higher and higher. At present, the application of metal coating has spread all over the various production and research departments of economic activities, and has grea...

AI Technical Summary

Problems solved by technology

However, the repair technology currently used is not ideal. The main defect is that the anode of the plating pen generally uses graphite during brush plating, which cannot replenish metal ions to the plating solution. As the brush plating process progresses, the concentration of metal ions in the plating solution Gradually decrease, the deposition rate and the quality of the coating also gradually decrease. When the metal ion concentration is lower than 40% of the original solution concentration, the plating solution has to be scrapped, and the scrapped plating solution needs strict discharge treatment

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