Holding device for barrel plating of patch components and application method of holding device

Abstract

The invention relates to the technical field of electronic component manufacturing, and discloses a holding device for barrel plating of patch components and an application method of the holding device. The holding device comprises a roller, a transmission device and a driving device, wherein an opening is formed in the side wall of the roller, one or more transmission teeth are arranged at the two sides, in the circumferential direction of the roller, of the opening correspondingly, and the plurality of transmission teeth at the same side are not on the same straight line; the transmission device comprises a transmission belt and a transmission shaft, one end of the transmission belt is installed at the peripheral side of the roller, the other end of the transmission belt is installed on the transmission shaft, and a plurality of positioning holes allowing the transmission teeth to be inserted are formed in the transmission belt, so that the transmission belt can close the opening while driving the roller to rotate through meshing of the transmission teeth and the positioning holes; and the driving device is connected to the transmission shaft to drive the transmission shaft to rotate. According to the holding device and the application method, the cross-sectional area of circulation of the electroplating liquid can be increased, the circulation efficiency of the electroplating liquid is improved, and the concentration of metal ions in the electroplating liquid can be kept stable, so that the quality of coating and barrel plating efficiency are improved.

Description

technical field [0001] The invention relates to the technical field of electronic component manufacturing, in particular to a holding device for barrel plating of patch components and a method for using the same. Background technique [0002] The multifunctionalization of electronic equipment has promoted the miniaturization of SMD components. 0201 specification (0.6mm in length and 0.3mm in width) SMD components have been widely used, and 01005 specification (0.4mm in length and 0.2mm in width) The application of chip components is becoming popular, and the smaller 008004 specification (0.25mm in length and 0.125mm in width) is also a future application trend. In order to meet the solderability and solder resistance requirements of surface mount, in the manufacturing process of SMD components, after the terminal electrodes are formed, it is generally necessary to form a nickel layer and a tin layer on the terminal electrodes by barrel plating. For small-sized patch compone...

AI Technical Summary

Problems solved by technology

[0003] In view of the above problems, the purpose of the present invention is to provide a holding device for barrel plating of chip components and its use method, so as to solve the problems of poor coating quality and low efficiency of barrel plating in existing barrel plating

Images