Preparation of linear bisphenol A phenolic resin

A technology of phenolic resin and novolac bisphenol, which is applied in the field of preparation of online bisphenol A phenolic resin, can solve the problems of reporting and not reducing bisphenol A phenolic resin, and achieve increased crosslinking density, improved heat resistance and moisture resistance Sexuality, the effect of promoting the reaction

Inactive Publication Date: 2009-08-05
CHINA PETROCHEMICAL CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the above two patents, the method for reducing bisphenol A phenolic resin residual bisphenol A is not reported

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0017] Add 200g of bisphenol A, 20g of n-butanol, and 44g of butanone into a four-necked flask equipped with a condenser, a thermometer, and a stirrer, heat up and stir to dissolve the reactants fully, add 2g of oxalic acid, and add polymer in 4 times at 90°C. Formaldehyde 20g, 5g each time, was added in 30 minutes, and the temperature was raised to 95°C to maintain the reaction for 4 hours. Then increase the temperature and reduce the pressure to remove the solvent, the temperature reaches 200°C, and when the pressure reaches -0.1Mpa, the pressure is released, and the product is poured out to obtain novolac bisphenol A phenolic resin.

Embodiment 2～12

[0019] The operating method is the same as in Example 1, and the reaction conditions and product results are shown in the following table.

[0020] Table 1 Reaction conditions

[0021]

Example

F / P Solvent type and dosage

% Catalyst type and dosage

% formaldehyde added

temperature °C formaldehyde added

time h maintain temperature

℃ maintenance time

h

1

0.76 n-Butanol 10%, Butanone

twenty two%

Oxalic acid 1%

90

0.5

95

4

2

0.3

Toluene 40% Toluenesulfonic acid 0.5%, B

Acid 0.2%

95

0.25

105

1

3

1.2 Isopropanol 15%, diiso

Propyl ether 10% Oxalic acid 0.7%, trifluorinated

Boron 0.7%

70

1

70

3

4

2.4 Methanol 30%, dioxane

50% Aluminum Oxide 1%, Phosphoric Acid

0.8%

105

2

110

6

5 ...

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PUM

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Abstract

The invention provides a preparation method of bisphenol A novolac phenolic resin, which comprises the following steps: bisphenol A is added in solvent with the weight being 25-100 percent of the weight of the bisphenol A, acidic catalyst with the weight being 0.7 to 2 percent of the weight of the bisphenol A, formaldehyde is continuously added at the temperature of 70-110 DEG C for 0.25-2.5 hours, all reactants react for 1-10 hour(s) at the temperature of 70-110 DEG C, and the reactants are heated and depressurized to remove the solvent, thus the bisphenol A novolac phenolic resin is obtained, wherein the mol ratio of formaldehyde and the bisphenol A is 0.3:1 to 3:1. The prepared bisphenol A novolac phenolic resin has the residual quantity of the bisphenol A of smaller than 15 percent, the softening temperature of 100-125 DEG C, and the dissolution iscosity of 63-67 percent of butanone solvent at 25 DEG C of 4000-6000 Pa.s. The invention has excellent physical property under the condition that the molecular weight is kept higher.

Description

technical field [0001] The invention relates to a preparation method of novolac bisphenol A phenolic resin. Background technique [0002] With the development of industrial technology, the demand for copper-clad laminates, the substrate of printed circuit boards, is increasing sharply. Its main uses are: data processing devices (computers, etc.), automatic control devices, communication equipment and household appliances. In order to meet the needs of high functionality, lightness, thinness, and miniaturization of these devices, copper-clad laminates are facing the thinning of wiring methods, miniaturization of through holes, and reduction of gaps, resulting in high density, miniaturization of components, and automation of processing. , The test of component installation automation, its electrical performance, mechanical performance, and processing performance must be further improved. In order to meet the needs of high density, it is also required for materials used as lam...

Claims

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Application Information

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IPC IPC(8): C08G8/04C08G8/20
Inventor 张晖唐光斌肖华任六波邓海波王新龙
Owner CHINA PETROCHEMICAL CORP
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