Encapsulation structure and method for tablet reconfiguration

Abstract

The invention relates to a chip reallocated packaging structure which comprises a chip with an active surface and a lower surface, and a plurality of weld pads allocated on the active surface; a packaging body is used for packaging the chip and exposing the weld pads on the active surface; one ends of a plurality of fanned-out wire sections are electrically connected every weld pad; a protective layer is used for covering the active surface of the chip and every wire section and exposing the other ends of the wire sections; and a plurality of electrically connected elements are electrically connected with the other ends of the wire sections, wherein, the packaging body adopts a two-stage thermosetting cement material.

Description

technical field [0001] The present invention relates to a semiconductor packaging method, in particular to a modular packaging structure formed by using a reconfiguration layer (RDL) after reconfiguring a chip or multiple chips to another substrate and its encapsulation method. Background technique [0002] Semiconductor technology has developed quite rapidly, so the miniaturized semiconductor chip (Dice) must have diversified functional requirements, so that the semiconductor chip must be configured with more input / output pads (I / O pads) in a small area. O pads), so that the density of metal pins (pins) is also rapidly increased. Therefore, the early lead frame packaging technology is no longer suitable for high-density metal pins; therefore, a ball array (Ball Grid Array: BGA) packaging technology has been developed. The ball array package has the advantage of higher density than the lead frame package. In addition, its solder balls are less prone to damage and deformati...

AI Technical Summary

Problems solved by technology

This thinned chip is reconfigured on another substrate, and then multiple small chips are formed into a package by injection molding; because the chip is very thin, the package is also very thin, so when the package is detached After the substrate, the stress of the package itself will cause the package to warp, increasing the difficulty of the subsequent cutting process

[0006] In addition, after wafer dicing, when relocating the small piece on another substrate with a size larger than the original substrate, it is necessary to pick up the small piece through a pick & place device, and then turn the small piece over. The active surface of the chip is attached to the substrate in the flip-chip method, and in the process of flipping the chip by the pick-and-place device, it is easy to generate tilt (tilt) and cause displacement. For example, if the tilt exceeds 5 microns, it will make the chip Unable to align, which makes it impossible to align in the subsequent ball planting process, resulting in reduced reliability of the packaging structure

[0007] For this reason, the present invention provides a packaging method that forms an alignment mark on the back of the wafer and reconfigures the chip before wafer dicing, which can effectively solve the problem of inability to align when ball planting and The problem of package warpage

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