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Non-contact type embedded body of electronic credential and method for producing the same

A non-contact, electronic certificate technology, applied to record carriers, computer parts, printing, etc. used by machines, can solve the problems of unsuitable certificate cover, lack of extensiveness, single material selection, etc., and achieve simple manufacturing methods, The effect of strong firmness and reduction of manufacturing cost

Inactive Publication Date: 2009-07-08
SHANGHAI MITE SPECIALITY & PRECISION PRINTING
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, the non-contact embedded body that is commonly used in card-type documents is not suitable for placing on the cover of the document because the material used is relatively stiff.
[0004] However, most countries now use specific materials as the constituent materials of the non-contact embedded body in the electronic passport documents of most countries. For example, in the patent US7059535, a special foamed polyolefin polymer material is used as the surface material of the non-contact embedded body. However, the choice of materials is relatively single and not extensive.

Method used

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  • Non-contact type embedded body of electronic credential and method for producing the same
  • Non-contact type embedded body of electronic credential and method for producing the same
  • Non-contact type embedded body of electronic credential and method for producing the same

Examples

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Effect test

example 1

[0036] refer to figure 1 In the structure shown, materials for the upper protective layer 1 , the upper connection layer 2 , the chip carrier layer 3 , the lower connection layer 4 , and the lower protective layer 5 are prepared. The upper protective layer 1 and the lower protective layer 5 use soft materials that are suitable for the document binding process and have a strong bonding force with traditional paper adhesives. The die-cutting of the chip hole is carried out on the chip carrying layer 3 , and then the embedding work of the non-contact coil and the chip 6 is carried out on the chip carrying layer 3 . In this example, the chip carrier layer 3 preferably has a thickness of 0.15-0.25mm, the upper connection layer 2 and the lower connection layer 4 have a thickness of 0.04-0.06mm, and the upper protective layer and the lower protective layer both have a thickness of 0.12-0.15mm. After all the materials are prepared, the figure 1 After the stacking is completed, lam...

example 2

[0038] like figure 2 As shown, the upper protective layer 1 and the upper connecting layer 2, the lower connecting layer 4 and the lower protective layer 5 are pre-compounded to obtain an upper composite fabric 12 and a lower composite fabric 45 with a thickness of 0.1 mm to 0.2 mm. The composite method can use high temperature thermal composite method, tape casting method to directly composite, or use adhesive bonding method, after bonding, perform high temperature and high pressure operation as described in Example 1, and finally make it as figure 2 Finished contactless insert shown.

example 3

[0040] like image 3As shown, when making a non-contact embedded body, adjust the structure of the non-contact embedded body according to the structure of the chip, such as adjusting the chip carrier layer 3 to a two-layer structure of the first layer structure 31 and the second layer structure 32, so as to Adapt to the thickness of the chip. For example, the thickness of the first layer structure 31 is 0.1mm, and the thickness of the second layer structure 32 is 0.15mm, and then according to the operation of Example 1, it is finally made as image 3 Finished touchless insert shown.

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Abstract

The invention provides a non-contact embedded body of an electronic certificate and a method for manufacturing the same. The embedded body comprises an upper protective layer, an upper connecting layer, a chip bearing bed, a lower connecting layer and a lower protective layer which are molten and compounded from top to bottom in sequence. The materials of the upper protective layer and the lower protective layer are a flexible material suitable for combining the certificate binding process and the prior paperhanging adhesive. The materials of the upper protective layer and the lower protective layer are fiber materials with a textile structure, or non-woven fabric, or paper or cotton fabric. The materials of the connecting layers are macromolecular and thermoplastic elastic films. The invention also provides the method for manufacturing the non-contact embedded body of the electronic certificate. The method comprise: melting and compounding the upper protective layer, the upper connecting layer, the chip bearing bed, the lower connecting layer and the lower protective layer from top to bottom to obtain the product. The embedded body has the advantages of strong fastness, warp resistance and flexure resistance. The material choosing range is widened through a reasonable layer structure, and the manufacturing method is simple and greatly reduces the manufacture cost.

Description

technical field [0001] The present invention relates to a non-contact embedded body (INLAY) of electronic documents, in particular to a non-contact identification embedded body used in the cover of electronic identity documents such as passports, pilot cards, seaman's cards, and journalist cards, and the manufacture of such embedded bodies method. Background technique [0002] With the deepening of anti-counterfeiting technology, the requirements for identification documents are getting higher and higher. Radio frequency identification technology (RFID) may be more applied to electronic identity documents due to its technical characteristics such as high security and no exposed contacts. How to make the non-contact inlay adapt to the assembly line binding process of the document, retain the binding process and style of the original document to the greatest extent, and control the overall requirements of the document after adding the inlay to meet the standards of the Interna...

Claims

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Application Information

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IPC IPC(8): B42D15/10G06K19/07B42D25/22B42D25/455
Inventor 陆泰伟李志明薛晓蓉瞿蓉蕖曹世庆杨四九赵毅喆
Owner SHANGHAI MITE SPECIALITY & PRECISION PRINTING
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