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Rare-earth doped leadless and low-melting point sealing glass and its preparation method

A sealing glass, low melting point technology, used in the formulation and preparation of stainless steel, electrical device sealing and sealing, electronics, rare earth-doped lead-free low melting point sealing glass

Inactive Publication Date: 2011-05-11
WUHAN UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0011] The technical problem to be solved by the present invention is: aiming at the requirement of lead-free low melting point sealing glass and the shortcoming of low stability of the existing low melting point sealing glass, Provide a formula and preparation method of rare earth-doped lead-free low-melting sealing glass

Method used

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Examples

Experimental program
Comparison scheme
Effect test

example 1

[0038] Second, according to the ingredient form and the corresponding measurement unit, use powder oxide, alumina, boric acid, silicon oxide, cobalt oxide, five phosphorus oxide, zinc oxide, carbonate, oxide, oxide, etc.Raw materials are weighed.Grind them together and mix them together.

[0039] Third, after putting each oxide into the grinding machine, the grinding machine is mixed and grinding for 0.5 to 1 hour until each oxide is mixed evenly.Put the mixed coordinated material into the platinum.

[0040] Fourth, put the platinum ingredients equipped with the material into the resistance furnace for heating.The process from room temperature to 1200 ° C is: from room temperature to 600 ° C, the temperature increase rate is 5 ° C / min; the temperature increase rate of 600 ° C to 1200 ° C is ≤2 ℃ / min, and it is insulated for 2 hours at 1200 ° C to make the glass cooperate withThe materials are fully melted.Use platinum tongs to clamp the platinum pupa from the heating furnace, and ...

example 2

[0045] Second, according to the ingredient form and the corresponding metering unit, powder oxide, alumina, boric acid, silicon oxide, cobalt oxide, zinc oxide, carbonate, oxide, oxide, oxidation, oxidation, oxide, oxide, oxide, oxidation, oxide, oxide, oxide, oxide, oxide, oxideOxidation 氧 氧.Grind them together and mix them together.

[0046] Third. Step 3 Same Example 1.

[0047] Fourth, put the platinum ingredients equipped with the material into the resistance furnace for heating.The process from room temperature to 1150 ° C is: from room temperature to 500 ° C, the temperature increase rate is 5 ° C / min; the temperature increase rate of 500 ° C to 1150 ° C ≤2 ℃ / min, and heat thermal insulation at 1150 ° C for 2 hours, make the glass cooperate withThe materials are fully melted.Use platinum tongs to clamp the platinum pupa from the heating furnace, and use the method of pouring to pour the glass liquid in the mold that is preheated in advance, make it a block -like glass, and ...

example 3

[0052] Second, according to the ingredient form and the corresponding measurement unit, use powder oxide, alumina, boric acid, silicon oxide, cobalt oxide, five phosphorus oxide, zinc oxide, carbonate, oxide, etc.quantity.Grind them together and mix them together.

[0053] Third. Step 3 Same Example 1.

[0054] Fourth, put the platinum ingredients equipped with the material into the resistance furnace for heating.The process from room temperature to 1100 ° C is: from room temperature to 500 ° C, the temperature increase rate is 5 ° C / min; the temperature increase rate of 500 ° C to 1150 ° C ≤ 2 ℃ / min, and for 2 hours at 1100 ℃, the glass cooperates withThe materials are fully melted.Use platinum tongs to clamp the platinum pupa from the heating furnace, and use the method of pouring to pour the glass liquid in the mold that is preheated in advance, make it a block -like glass, and then anneal the glass.The annealing system is: 0.5 hours at the temperature (380 ° C) (380 ° C) at th...

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Abstract

The invention relates to a method for preparing rare earth doped lead-free sealing glass with low melting point, which comprises the following steps: based on raw materials adopted by a Bi2O3-ZnO-B2O3 glass system, adding proper amount of rare earth oxide into the raw materials, and mixing, melting, annealing, grinding and sieving the mixture to obtain the rare earth doped lead-free sealing glass with the low melting point. The sealing glass comprises the following main components by weight portion: 65.22 to 85.22 portions of bismuth oxide, 4.63 to 11.78 portions of boric acid, 5.76 to 10.76 portions of zinc oxide, 0.80 to 2.80 portions of copper oxide, 0.42 to 2.42 portions of cobalt oxide, 3.32 to 8.47 portions of barium carbonate, 0.4 to 1.8 portions of aluminum oxide, and 0.1 to 6.0 portions of rare earth oxide. The method solves the problems that the sealing glass with the low melting point has low sealing temperature, high sealing strength, stable glass structure and the like under lead-free conditions, and has the advantages of simple process, practicability and reliability; and the prepared rare earth doped lead-free sealing glass with the low melting point is particularly suitable for sealing and closing of stainless steel materials, electrons and electric appliances.

Description

Technical field [0001] The present invention involves glass materials, especially a formula and preparation of a rare earthy lead low -melting point sealing glass. This material is particularly suitable for the sealing and confinement of stainless steel, electronics, and electrical devices. Background technique [0002] Low melting point sealing glass refers to the middle glass that seals glass, ceramics, metals and composite materials, and its melting point is significantly lower than ordinary glass sealing glass.With the development of modern science and technology, especially vacuum electronics technology, microelectronics technology, laser and infrared technology, electro -optical sources and high -energy physics and Aerospace Industry, energy, automotive industry, chemical industry, industrial testing and other fields, the device of the deviceThe degree of precision of miniaturization and structural components has continued to increase, the types of electronic components are...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C03C8/24
Inventor 何峰程金树谢俊郑伟宏陆平
Owner WUHAN UNIV OF TECH
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