Aromatic diamines monomer with double miscellaneous naphthalenone structures and trifluoromethyl substituted and preparation thereof

Abstract

The invention relates to an aromatic diamines monomer with double miscellaneous naphthalenone structures and trifluoromethyl substituted and a preparation method thereof. A diamine structure is prepared according to the following steps: (1), 4,4'-oxygen-bis(4-(1,4-phenyl)-phthalazine-1-ketone) reacts with 2-chlorine-5-nitro benzotrifluoride under an alkaline condition according to a molar ratio of 1 to 2, and then a dinitro compound is acquired; and (2), the dinitro compound is reduced in organic solvent by palladium-charcoal and hydrazine hydrate, and then the monomer is acquired; and the monomer can be used to prepare polyimide and aromatic polyamides. The prepared aromatic diamines with double miscellaneous naphthalenone structures and trifluoromethyl substituted has high purity, and is steady at normal temperature; and the polyimide and the aromatic polyamides prepared by the aromatic diamines monomer have excellent comprehensive properties such as good solubility and film forming capability, strong high temperature resistance and excellent mechanical properties, high optical transparency, low dielectric constant and the like.

Description

technical field [0001] The invention belongs to the field of aromatic diamine monomers and their preparation, and in particular relates to aromatic diamine monomers containing bis-naphthalene structures and trifluoromethyl-substituted aromatic diamines and their preparation. Background technique [0002] Both polyimide and polyaramid are heat-resistant polymer materials with excellent comprehensive properties. Since the industrialization began in the 1960s and 1970s, they have been applied in various fields. Especially as a high-performance fiber, a high heat-resistant composite material matrix and an electronic packaging material, it has been widely used in aerospace, machinery, microelectronics, petrochemical and other industries. Although such high-temperature resistant materials have excellent comprehensive properties, due to their rigid main chain structure, strong interaction between molecules and close packing of molecular chains, most polyimides and polyarylamides ...

AI Technical Summary

Problems solved by technology

[0004] Although the introduction of fluorine-containing side groups and ether bonds solves the problem of polyimide insolubility, due to the introduction of a relatively large density of flexible structural unit ether bonds in the main chain of the polymer molecule, the glass of this type of polyimide The melting temperature is generally only between 200 and 300 °C, which has a greater loss compared with commercial polyimides, which reduces the high temperature resistance of polyimides to a certain extent.

Images