Double-surface position alignment apparatus and method

Abstract

The invention provides a double-side position aligning device and a double-side position aligning method. The double-side position aligning device comprises a mask plate provided with a mask aligning mark, a work piece table provided with a reference aligning mark, a silicon chip illuminating system and an optical projecting system, and also comprises a mask position aligning device, an exposure object, a first side position aligning device, a second side position aligning device, an image collecting and processing system, and a control system, wherein the mask plate is horizontally arranged. The double-side position aligning device and the method can complex structural design and assembly of the exposure object and the work piece table, and can also improve technological adaptability of a back position aligning device for a silicon chip to a back aligning mark of the silicon chip.

Description

technical field [0001] The present invention relates to a double-sided position alignment device and method, and in particular to a double-sided position alignment device and method utilizing an ultraviolet illumination optical system, a visible light illumination optical system and an infrared illumination optical system. Background technique [0002] With the continuous improvement of people's living standards and the development of semiconductor technology, the semiconductor market will continue to increase the requirements for the intelligence and miniaturization of semiconductor packaging devices in the future. Digital products such as cameras, mobile phones, and PDAs are not only required to be small and easy to carry. It is also required to have multiple functions and low cost performance. In order to realize the development requirements of intelligence and miniaturization of packaged devices, there is a need for a multi-chip (silicon chip) package solution. Multi-di...

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Problems solved by technology

However, the above two silicon wafer back position alignment methods mainly have the following disadvantages in structural realization: the alignment light source is visible light, and the optical projection objective is required to be achromatic in the visible light alignment band or the alignment device is required to be aligned with the optical projection objective. Compensation for the chromatic aberration generated by the wave band, which will increase the complexity of the design of the optical projection objective lens or the position alignment device and increase the design cost; two sets of optical path turning systems are installed at the bottom ends of both sides of the silicon wafer carrier, resulting in the structural design of the workpiece table. It is more complicated to assemble; there are specific requirements for the position of the back alignment mark on the silicon wafer, and the corresponding back alignment mark of the silicon wafer needs to be made at the designated position of the silicon wafer, so the process adaptability of the back alignment mark is relatively poor ;Limited by the position of the optical path turning system at the bottom of both sides of the silicon wafer carrier, only the entire silicon wafer can be aligned in the whole field, and it cannot be aligned field by field according to the requirements of the process for overlay accuracy

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