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Production method for direct growth of one-dimensional nano cuprous oxide array on metallic copper substrate

A technology of copper substrate and metal copper, which is applied in nanostructure manufacturing, chemical instruments and methods, copper oxide/copper hydroxide, etc., to achieve excellent field emission performance, good visible light catalytic performance, and wide application prospects

Inactive Publication Date: 2009-05-13
HUAZHONG NORMAL UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although one-dimensional Cu has been grown on the substrate 2 O nanowires were reported (Langmuir2005, 21, 4726; Nano Lett.2004, 4, 2337.), but array-like one-dimensional Cu 2 The preparation of O remains a challenge

Method used

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  • Production method for direct growth of one-dimensional nano cuprous oxide array on metallic copper substrate
  • Production method for direct growth of one-dimensional nano cuprous oxide array on metallic copper substrate
  • Production method for direct growth of one-dimensional nano cuprous oxide array on metallic copper substrate

Examples

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Effect test

Embodiment 1

[0035] Polish the surface of 8cm×8cm copper foil with sandpaper and soak it in 20% (weight) concentrated hydrochloric acid for 10 seconds to remove the oxide on the surface, wash the surface with distilled water for 3 times, and then ultrasonically wash the copper foil in ethanol Remove the organic matter on the surface and dry it for later use; the copper foil is used as the anode, the titanium is the cathode, and there is a diaphragm (heterogeneous quaternary ammonium anion exchange membrane, the same below) between the cathode and the anode to prevent the hydrogen bubbles generated by the cathode from contacting the anode ; 3.5M sodium chloride (NaCl) and 0.01M cetyltrimethylammonium bromide (CTAB) are ultrasonically mixed and poured into the anode chamber in the electrolytic cell, and 0.1M sodium hydroxide (NaOH) is used as the cathode Electrolyte, after the temperature of the electrolytic cell rises to 80°C, adjust the electrolytic current density to 0.06A / cm 2 ; After 10...

Embodiment 2

[0039] Put the copper net of 15cm * 15cm into 10% (weight) concentrated hydrochloric acid and soak for 1 minute to remove the oxide on the surface, wash the surface with distilled water for 3 times, then ultrasonically wash the copper net in ethanol to remove the organic matter on the surface, bake Standby after drying; the copper mesh is used as the anode, the nickel alloy is the cathode, and there is a diaphragm between the cathode and the anode; 1M potassium chloride (KCl) and 0.001M glucose are ultrasonically mixed and then poured into the anode chamber in the electrolytic cell, and 0.1 M Potassium hydroxide (KOH) is used as the catholyte, and after the temperature of the electrolytic cell rises to 50°C, adjust the electrolytic current density to 0.05A / cm 2 After 20 minutes of electrolysis, take out the copper foil, put it into distilled water for cleaning, and soak it in the alcohol solution containing 1‰ (weight) benzotriazole for 3 hours; wash it with ethanol after takin...

Embodiment 3

[0042] After polishing the surface of the 10cm×10cm copper sheet, put it into 30% (weight) concentrated hydrochloric acid and soak for 10 seconds to remove the oxide on the surface, wash the surface 3 times with distilled water, and then remove the copper sheet by ultrasonic cleaning in ethanol The organic matter on the surface is standby after drying; the copper sheet is used as the anode, the nickel alloy is the cathode, and there is a diaphragm between the cathode and the anode; 0.005M ammonium chloride (NH 4 Cl) and 0.1M polyvinyl alcohol are ultrasonically mixed and poured into the anode chamber in the electrolytic cell, 10M potassium hydroxide (KOH) is used as the catholyte, and after the temperature of the electrolytic cell rises to 90°C, the electrolytic current density is adjusted to 0.1 A / cm 2 After 5 minutes of electrolysis, take out the copper sheet, put it into distilled water for cleaning, and soak it in the alcohol solution containing 1‰ (weight) benzotriazole f...

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Abstract

In chloride media, copper anodic dissolution is a mature process for producing cuprous oxide (Cu2O); and based on the preparation process, the invention provides a method for directly growing a one-dimensional nanometer Cu2O array on an anode metal copper substrate through adding a surface active agent to an anode slot, and controlling the concentration of electrolyte chloride salt in the anode slot, the concentration of alkali in a cathode slot, electric quantity of electrolysis and electrolysis temperature. The array has controllable appearance, and consists of a nanometer belt, a nanometer plate and a nanometer line, wherein the top end of the one-dimensional array can be acicular, circular, and the like. The one-dimensional nanometer Cu2O array directly growing on the copper substrate has excellent effect of field emission performance and visible light catalysis, and has wide application prospect in technical fields of vacuum microelectronic devices, panel display, advanced oxidation and other aspects.

Description

technical field [0001] The invention relates to a method for growing one-dimensional nanomaterials and arrays thereof on metal substrates by electrochemical methods, in particular to growing one-dimensional nano-Cu on metal copper substrates 2 O-array preparation method. Background technique [0002] One-dimensional nanomaterials have practical and potential applications in many fields. It is of great significance to develop new synthesis methods and new properties of one-dimensional nanomaterials (Appl.Phys.Lett.1997, 71, 2770). The key to the growth of one-dimensional nanomaterials is how to suppress the symmetric growth of crystals and provide a driving force for their anisotropic growth. For the crystal structure, no matter which synthesis method is used, it consists of two steps of nucleation and crystal growth. By finding suitable nucleation and growth conditions, the regulated growth of one-dimensional nanostructures can be realized. Because metal materials are che...

Claims

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Application Information

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IPC IPC(8): C30B30/02C30B29/16C30B29/62C25D11/34C01G3/02B82B3/00
Inventor 李家麟余颖王艳阎丽丽
Owner HUAZHONG NORMAL UNIV
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