Eureka AIR delivers breakthrough ideas for toughest innovation challenges, trusted by R&D personnel around the world.

Recovery method of waste circuit board

A technology of discarded circuit boards and recycling methods, applied in the direction of electronic waste recycling, recycling technology, solid waste removal, etc., can solve the problems of easy pollution of the environment, high energy consumption, high energy consumption and environmental pollution, and achieve good quality, The effect of low energy consumption and simple equipment

Inactive Publication Date: 2009-05-06
CENT SOUTH UNIV
View PDF7 Cites 33 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

These two types of equipment rely on shearing, impact and centrifugation to crush waste circuit boards. Although the crushing efficiency has been improved, they still have the disadvantages of high energy consumption and easy environmental pollution.
[0014] The above method separates and recycles the waste circuit board components, and the recycling process has the disadvantages of high energy consumption and easy pollution of the environment.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Recovery method of waste circuit board
  • Recovery method of waste circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0037] 1. Put the discarded circuit boards with electronic components into an oil bath at 220°C to 300°C and heat until the solder melts. Then, put the discarded circuit boards with melted solder in a centrifuge, start the motor to rotate for 6 minutes, and solder It is detached from the circuit board under the centrifugal force generated by the rotation to realize recycling.

[0038] 2. Place the desoldered substrate and electronic components in a vacuum pyrolysis device to heat to 500°C, hold the final temperature for 20 minutes, collect the gas generated by thermal cracking, and condense it into liquid oil in a -20°C condensing device.

[0039] 3. Collect the pyrolysis oil obtained from pyrolysis, the circuit board substrate and electronic components after pyrolysis, so that the next step can be classified and recovered or separated and recovered.

[0040] in conclusion:

[0041] ①In the desoldering step, all electronic components fall off, and no electronic components are...

Embodiment 2

[0044] 1. Put the discarded circuit boards with electronic components into an oil bath at 220°C to 300°C and heat until the solder is melted. Then, put the discarded circuit boards with melted solder in a centrifuge, start the motor to rotate for 8 minutes, and solder It is detached from the circuit board under the centrifugal force generated by the rotation to realize recycling.

[0045] 2. Place the desoldered substrate and electronic components in a vacuum pyrolysis device to heat to 550°C, hold the final temperature for 30 minutes, collect the gas generated by thermal cracking, and condense it into liquid oil in a -30°C condensing device.

[0046] 3. Collect the pyrolysis oil obtained from pyrolysis, the circuit board substrate and electronic components after pyrolysis, so that the next step can be classified and recovered or separated and recovered.

[0047] in conclusion:

[0048] ①In the desoldering step, all electronic components fall off, and no electronic components...

Embodiment 3

[0051] 1. Put the discarded circuit boards with electronic components into an oil bath at 220°C to 300°C and heat until the solder is melted. Then, put the discarded circuit boards with melted solder in a centrifuge, start the motor to rotate for 10 minutes, and solder It is detached from the circuit board under the centrifugal force generated by the rotation to realize recycling.

[0052] 2. Place the desoldered substrate and electronic components in a vacuum pyrolysis device to heat to 600°C, hold the final temperature for 40 minutes, collect the gas generated by thermal cracking, and condense it into liquid oil in a -40°C condensing device.

[0053] 3. Collect the pyrolysis oil obtained by pyrolysis, the circuit board substrate and electronic components after pyrolysis, so as to classify and recover or separate and recover in the next step.

[0054] in conclusion:

[0055] ①In the desoldering step, all electronic components fall off, and no electronic components are attach...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a method for recovering waste circuit boards. The method comprises the following: 1. a step of heating and centrifugally separating, which is to put the waste circuit boards in an oil bath, heat to melt solder and pass the waste circuit boards with the solder melted through a centrifugal machine so as to efficiently separate the solder from the waste printed circuit boards; 2. a step of cracking in vacuum, which is to put waste circuit board substrates with the solder removed, as well as an electron component in a vacuum cracking device, heat for thermal cracking, collect thermal-cracking volatile products and condense the volatile products into fluid oil; and 3. a step of collecting solid matter after vacuum cracking, which is to classify and collect the electron component and the circuit board substrates after thermal cracking, so as to recover precious metals and other valuable metals of the electron component, as well as copper foil, glass fiber and other substances on the circuit board substrates. The method performs treatment by stages according to the structural characteristics of the waste circuit boards, has the advantages of simplicity, no pollution, low cost, high efficiency and high rate of recovering waste resources of the waste circuit boards, and is suitable for industrial application and the large-scale recovery of the waste circuit boards.

Description

technical field [0001] The invention discloses a method for recycling waste circuit boards, which belongs to the technical field of resource recovery and reuse of waste electronic and electrical products. Background technique [0002] The present invention is a recycling process researched and developed for a large number of waste printed circuit boards (printed circuit board, PCB). With the rapid development of the economy and the electronic information industry, the replacement of electronic and electrical products is increasing, and the service life of the products is shortened, resulting in a large number of electronic products being discarded. Waste printed circuit boards are a major part of electronic waste, and their recycling has become a global problem that needs to be solved urgently. Discarded circuit boards are different from general solid waste. In addition to precious metals and other valuable metals, they also contain lead, cadmium, mercury, hexavalent chromi...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): C22B25/06C10G1/00B09B3/00
CPCY02P10/20Y02W30/82
Inventor 丘克强周益辉
Owner CENT SOUTH UNIV
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com