Solder ball loading method and solder ball loading apparatus

A technology of solder balls and pads, used in tin feeding devices, soldering equipment, assembling printed circuits with electrical components, etc., can solve problems such as solder bump peeling, and achieve high uniformity and good wettability.

Inactive Publication Date: 2010-12-08
IBIDEN CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] However, in the method of mounting solder balls using the above-mentioned cylindrical member, when solder balls are reflowed to form solder bumps, cavities are likely to be left in the solder bumps, and the cavities expand after heating, causing the solder bumps to be damaged. Stripped from via

Method used

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  • Solder ball loading method and solder ball loading apparatus
  • Solder ball loading method and solder ball loading apparatus
  • Solder ball loading method and solder ball loading apparatus

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0043] The solder ball loading device 20 of the first embodiment can transport solder balls by fixing the loading cylinder 24 and moving the ball array mask 16 and the printed wiring board 10 . In addition, the solder balls may be conveyed by moving the mounting cylinder 24 by fixing the ball array mask 16 and the printed wiring board 10 .

[0044] Refer to the section showing the cross section of the carrying cylinder 24 figure 2 The structure of the carrying cylinder 24 will be described.

[0045] The mounting cylinder 24 is composed of a supply cylinder 26 for supplying the inert gas and a suction cylinder 25 for sucking the supplied inert gas. figure 1 The inert gas supplied from the shown inert gas cylinder 28 through the pipe 26B is discharged from between the opening 26A of the supply cylinder 26 and the lower end periphery 25C of the suction cylinder 25 . On the other hand, using the figure 1 The negative pressure generated by the shown suction box 27 sucks the ine...

Embodiment 2

[0064] Figure 9 The mounting cylinder 125 of Example 2 is shown. refer to figure 2 , the above-mentioned carrying cylinder has a double structure, and the inert gas is supplied from the supply cylinder 26 outside the suction cylinder 25 . On the other hand, in Example 2, the nozzle 126 for supplying the inert gas is provided around the opening 125A of the mounting cylinder 125 . Even if the structure of this Example 2 is used, it is possible to prevent voids from being entangled in the solder bump in the same manner as in Example 1. FIG.

[0065] Next, the results of a comparison test between solder bumps manufactured by the solder ball mounting method of Example 1 and solder bumps manufactured by sucking air to transport the solder balls will be described.

[0066] Example 1

[0067] (1) Production of printed circuit boards

[0068]A double-sided copper-clad laminate (for example, MCL-E-67 manufactured by Hitachi Chemical Industries, Ltd.) is used as a material, and ...

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Abstract

This invention provides a solder ball loading apparatus which enables fine solder balls to be loaded on pads while void is blocked from being caught into bump upon reflow. Inactive gas is supplied and the inactive gas is sucked from a loading cylinder located above a ball arrangement mask so as to gather solder balls. The gathered solder balls are rolled on the ball arrangement mask by moving theloading cylinder horizontally and the solder balls are dropped onto connecting pads on a multilayer printed wiring board through openings in the ball arrangement mask. Oxidation of the solder balls and mixture of voids upon reflow are prevented by loading the solder balls in the atmosphere of inactive gas.

Description

technical field [0001] The present invention relates to a solder ball mounting method and a solder ball mounting device for mounting solder balls forming solder bumps on a printed wiring board. Background technique [0002] Japanese Patent Application Laid-Open No. 2006-74001 discloses mounting solder balls on pads of a printed wiring board using a manufacturing method including the following steps. [0003] (1) The openings of the alignment mask are aligned with the pads of the printed wiring board. [0004] (2) Air is sucked by the cylindrical member, and the solder balls are collected on the alignment mask below the cylindrical member. [0005] (3) The barrel member is moved so that the solder balls are mounted on the pads of the printed wiring board through the openings of the alignment mask. [0006] Patent Document 1: Japanese Unexamined Patent Publication No. 2006-74001 [0007] However, in the method of mounting solder balls using the above-mentioned cylindrical m...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/34
CPCH05K2203/082H05K2203/0557H05K3/3478H01L2224/11334H05K2201/09481B23K3/0623H05K3/4644H05K2203/0195H01L2224/05573H01L2224/05568H01L2924/00014Y10T29/53213Y10T29/49149Y10T29/49147Y10T29/49204Y10T29/53209Y10T29/49222Y10T29/53204H01L2224/05599
Inventor 川村洋一郎丹野克彦
Owner IBIDEN CO LTD
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