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Apparatus for recycling the disposed slurry produced in the manufacturing process of the silicon wafer

A manufacturing process and recycling technology, applied in the direction of manufacturing tools, stone processing equipment, metal processing equipment, etc., can solve the problems of complex slurry recycling equipment, achieve excellent recycling efficiency, simple operation principle, and minimize process time Effect

Active Publication Date: 2009-04-01
张煐哲
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

These devices complicate slurry recirculation equipment

Method used

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  • Apparatus for recycling the disposed slurry produced in the manufacturing process of the silicon wafer
  • Apparatus for recycling the disposed slurry produced in the manufacturing process of the silicon wafer
  • Apparatus for recycling the disposed slurry produced in the manufacturing process of the silicon wafer

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Embodiment approach

[0042] figure 1 is a schematic diagram of a process for separating and recycling abrasives, sawdust, and cutting oil from a used slurry according to an exemplary embodiment of the present invention.

[0043] In order to recycle the used slurry by separating and recovering abrasive and cutting oil from the used slurry, two centrifugation steps are performed.

[0044] A first centrifugal separation step is performed to separate the used slurry into a solid substance mainly containing an abrasive made of SiC and a first liquid substance mainly containing cutting oil. Then, a second centrifugation step is performed at high speed to remove finely divided Si sawdust from the first liquid substance, thereby recirculating the cutting oil, which has a density similar to fresh oil, eg, 0.89 g / cc.

[0045] figure 2 for execution figure 1 A sketch of the equipment for recycling used slurry for the process shown.

[0046] The used slurry that has flowed into the tank car or drum 1 is fe...

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Abstract

An apparatus for recycling disposed slurry produced in a manufacturing process of silicon wafers, and more particularly, an apparatus for recycling disposed slurry by effectively separating and recovering abrasive and cutting oil from the disposed slurry is provided. The apparatus for recycling disposed slurry produced in a manufacturing process of silicon wafers, including: a first heater for heating the disposed slurry at a temperature ranging from 60 DEG C to a boiling point; a first centrifugal separator for rotating the disposed slurry heated by the first heater, at a rotation speed ranging from 1200rpm to 1500rpm in order to separate into a solid matter and a first liquid matter via centrifugation; a second heater for heating the first liquid matter separated by the first centrifugal separator, at a temperature ranging from 5O DEG C to a boiling point; and a second centrifugal separator for rotating the first liquid matter heated by the second heater, at a rotation speed of at least 2800rpm in order to separate into sawdust and a second liquid matter via centrifugation.

Description

technical field [0001] The present invention relates to an apparatus for recycling used slurry generated in a silicon wafer manufacturing process, and more particularly, to recycling used slurry by effectively separating and recovering abrasives and cutting oils from used slurry. Equipment for slurry recycling. Background technique [0002] With rapid advances in information technology and the semiconductor industry, the demand for monocrystalline silicon wafers is increasing dramatically. As is well known in the art, single crystal silicon wafers are typically produced by cutting a single crystal silicon ingot with an abrasive coated wire saw while supplying cutting oil. Then, the wafer is polished with a grinder. In this process, about 20-30% of the initial monocrystalline silicon ingot is wasted as sawdust. [0003] During the manufacturing process of single crystal silicon wafers, by-products such as abrasives (silicon carbide, aluminum oxide and silicon dioxide), saw...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/304H01L21/66
CPCB28D5/007B24B57/00Y02P70/10
Inventor 张煐哲
Owner 张煐哲
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