Low temperature use method of high temperature solder

Abstract

The invention belongs to the field of solder and welding technology and particularly relates to a method of low-temperature use of high-temperature solder; the method comprises the following steps of: a. the preparation of the solder: high-temperature alloy powder consists of more than one of the alloy from SnPb, SnBi, SnAg, SnAgCu, SnZn, SnCu, and SnSb and more than one of Ni, Ag, Cu and Ti are mixed and a soldering agent is added so as to prepare the solder, wherein, the quality percentage is Ni: 3 to 5 percent, Ag: 10 to 21 percent, Cu: 12 to 15 percent and Ti: 3 to 6 percent; b. the preparation of the objects to be welded and adding the solder to the positions to be welded; and c. according to the diferent types of the solder, the solder and the objects to be welded are heated to the temperature between 230 DEG C to 350 DEG C, then cooled, thus realizing the welding of the solder. The welding method has the excellent anti-collapsement performance in the welding process. The welding spot or the welding surface after welded has good wire performance and thermal conductivity.

Description

technical field [0001] The invention belongs to the field of high-temperature solder welding methods, and in particular relates to a method capable of realizing high-temperature solder welding at low temperature, which can realize the connection between various materials. Background technique [0002] Among the commonly used connection processes at present, welding technology can basically realize the connection between various materials. In the widely used soldering technology, the soldering materials are mainly tin-based solders such as SnPb, SnAg, SnCu, SnZn, SnBi and other systems with relatively low melting points. The melting temperature is below 250°C, and the reliability of the formed solder joints is greatly reduced when the operating temperature is close to 150°C to 200°C. Electronic components require the use of high temperature resistant solder. [0003] The commonly used high-temperature solders, such as SnPb95, have a melting point above 300°C. In the commonl...

AI Technical Summary

Problems solved by technology

[0003] The commonly used high-temperature solders, such as SnPb95, have a melting point above 300°C. In the commonly used soldering process, they need to be heated to the melting point temperature of the solder or above the melting point temperature, which makes the temperature of the soldering part high and easily causes thermal deformation of the parts. And distortion, in addition, the temperature that the equipment needs to withstand is also high, resulting in harsh process conditions and increased costs

[0004] In addition, due to the low temperature of many components or materials, many solders cannot be used. For example, if the soldering temperature of electronic components is too high, it will cause damage to the device; in addition, if the temperature is too high, it is easy to cause serious corrosion of solder joints