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Method for polishing diamond rectangle micropore mold die hole

A microporous mold and diamond technology, which is used in grinding/polishing equipment, manufacturing tools, metal processing equipment, etc., can solve the problems of affecting shape, not suitable for rectangular hole mold polishing, polishing narrow-band twist fracture, etc., and achieve high polishing efficiency. Effect

Active Publication Date: 2009-01-21
CHENGDU HONGBO INDAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] (1) The position of the round hole mold in the fixture has no direction at all, that is, polishing in any direction in the fixture position can achieve the same effect, and the position of the rectangular hole mold in the fixture has directionality, otherwise the sides of the rectangle The amount of grinding is different, which affects its shape, so the fixture of the round hole mold is not suitable for the polishing of the rectangular hole mold;
[0007] (2) The processing method is not suitable. The polishing line section of the round hole mold is round, and the mold can be rotated, while the polishing line section of the rectangular hole mold is rectangular, and the mold cannot be rotated, otherwise the narrow polishing belt will be twisted and broken.

Method used

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  • Method for polishing diamond rectangle micropore mold die hole
  • Method for polishing diamond rectangle micropore mold die hole
  • Method for polishing diamond rectangle micropore mold die hole

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0037] Such as Figure 4 As shown, the polishing method of the diamond rectangular microporous die hole provided by the present embodiment comprises the following steps:

[0038] Clamping the mold 1 into the fixture, adjusting the position of the mold 1 in the fixture, so that the direction of the polished surface of the mold is consistent with the polishing surface of the polishing narrow strip 2;

[0039] Clamp the polishing narrow belt 2 so that the normal line of the polishing narrow belt 2 is 0-25° to the wide side of the rectangular die hole, and make the deflection of the polishing narrow belt 2 when polishing the lubricating area 19 of the rectangular die hole, polishing the compression area 20 and polishing the size maintaining area 21 The angle is 0°, the upper wire clamp 17 and the lower wire clamp 18 move up and down at the same time to drive the polishing narrow 2 to reciprocate up and down to polish the rectangular die hole;

[0040] Adjust the upper line clamp ...

Embodiment 2

[0047] Such as Figure 5 As shown, the polishing method of the diamond rectangular microporous die hole provided by the present embodiment comprises the following steps:

[0048] Clamp the mold 1 into the fixture, adjust the position of the mold 1 in the fixture, so that the direction of the polished surface of the mold is consistent with the polishing surface of the polished narrow strip 2, and the mold 1 makes a reciprocating linear motion in the horizontal direction;

[0049] Clamp the polishing narrow belt 2 so that the normal line of the polishing narrow belt 2 is 0-25° to the wide side of the rectangular die hole, and make the deflection of the polishing narrow belt 2 when polishing the lubricating area 19 of the rectangular die hole, polishing the compression area 20 and polishing the size maintaining area 21 The angle is 0°, the upper wire clamp 17 and the lower wire clamp 18 move up and down at the same time to drive the polishing narrow belt 2 to reciprocate up and d...

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Abstract

The invention discloses a method for polishing the die hole of a diamond rectangular microporous die; the basic proposal is as follows: the die is clamped in a clamp which is matched with the die, the position and direction of the die in the clamp can be adjusted, a polishing narrow band does up and down reciprocating motion to polish one group of opposite sides of the die hole of the die one by one, then the die turns at 90 degrees, the polishing narrow band polishes another group of opposite sides, in this way, the whole periphery in the die hole can be polished. The method for polishing the die hole of the diamond rectangular microporous die provided by the invention can polish a rectangular micropore, and can grind both the long edge and width edge of the rectangular die hole so as tofacilitate the maintenance of the shape of the die hole; the narrow band can not be distorted and broken in the polishing process, and the polishing efficiency is high.

Description

technical field [0001] The invention relates to a polishing method for a die hole of a mold, in particular to a polishing method for a die hole of a diamond rectangular microporous die. Background technique [0002] The semi-finished products of diamond wire drawing dies (referred to as: dies) are generally processed by laser. To meet the requirements, they must be polished and the aperture diameter is determined. Most of the finished products of diamond circular microporous wire drawing dies are ground and processed in the following two ways: [0003] 1. The steel needle coated with abrasive is inserted into the mold hole, and the polishing of the mold hole wall and the determination of the mold hole size are achieved through the left and right deflection of the steel needle and the rotational movement of the mold (such as figure 2 shown): [0004] 2. Apply abrasive on the polishing line passing through the mold hole, and achieve hole wall polishing and mold aperture size ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B21/02
Inventor 廖承勇华文斗
Owner CHENGDU HONGBO INDAL
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