Reagent kit for preparing chemical mechanical polishing aqueous dispersion, and use thereof

一种化学机械、分散体的技术，应用在化学机械研磨,化学机械研磨用水系分散体领域

Inactive Publication Date: 2008-12-24
JSR CORPORATIOON
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, scratch-like surface defects called "scratches" may also occur

Method used

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  • Reagent kit for preparing chemical mechanical polishing aqueous dispersion, and use thereof
  • Reagent kit for preparing chemical mechanical polishing aqueous dispersion, and use thereof
  • Reagent kit for preparing chemical mechanical polishing aqueous dispersion, and use thereof

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0111] 4.2 Preparation method of chemical mechanical grinding aqueous dispersion

[0112] The chemical mechanical polishing aqueous dispersion preparation kit of this embodiment can be prepared by mixing the first composition and the second composition constituting the kit, and further mixing with the third composition containing an oxidizing agent as needed. Mechanical milling of aqueous dispersions. As this mixing method, the following aspects can be employed.

[0113] (1) The first composition, the second composition, and the third composition containing an oxidizing agent may be mixed in advance to prepare a chemical mechanical polishing aqueous dispersion, and the chemical mechanical polishing aqueous dispersion may be prepared from a slurry The supply nozzle 32 supplies the above-mentioned flow rate onto the turntable 40 .

[0114] (2) Any one of the first composition or the second composition may be mixed with the third composition containing an oxidizing agent, each ...

Embodiment 2

[0202] (a) Preparation of the first composition

[0203] Ion-exchanged water was added to the colloidal silica C2-containing aqueous dispersion prepared in the above "5.1.1" so that the content of the colloidal silica C2-containing aqueous dispersion was equivalent to 18.5% by mass in terms of inorganic particles The amount, and then add potassium hydroxide to adjust the pH to 10.0. Then, ion-exchanged water was added so that the total amount of all constituents became 100% by mass, followed by filtration with a filter having a pore diameter of 1 μm to obtain an aqueous dispersion (C) containing 18.5% by mass of colloidal silica. In addition, this aqueous dispersion (C) was uniformly dispersed, and the average particle diameter of the colloidal silica in the aqueous dispersion (C) was 45 nm.

[0204] (b) Preparation of the second composition

[0205] 0.2% by mass of quinolinic acid and 0.8% by mass of benzotriazole were dissolved in ion-exchanged water, and polyacrylic acid ...

Embodiment 3

[0217] (a) Preparation of the first composition

[0218] Add the aqueous dispersion containing colloidal silica C1 prepared in "5.1.1" above, the aqueous dispersion containing colloidal silica C3 prepared in "5.1.1" above, and ion-exchanged water to make the The content of the aqueous dispersion containing colloidal silica C1 was equivalent to 0.8% by mass in terms of inorganic particles, and the content of the aqueous dispersion containing colloidal silica C3 was equivalent to 10.0% by mass in terms of inorganic particles, and then added Potassium hydroxide adjusted the pH to 10.3. Then, ion-exchanged water was added so that the total amount of all constituents became 100% by mass, followed by filtration with a filter having a pore diameter of 1 μm to obtain an aqueous dispersion (E) containing 10.8% by mass of colloidal silica. In addition, this aqueous dispersion (E) was uniformly dispersed, and the average particle diameter of the colloidal silica in the aqueous dispersio...

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Abstract

The invention relates to a kit for preparing water system dispersoid for chemically machinery grinding and use thereof, The object of the invention is to provide a preparation method of water system dispersoid for chemically machinery grinding, and kit for preparing water system dispersoid for chemically machinery grinding with excellent longterm storage stability even in the concentration state, wherein the water system dispersoid for chemically machinery grinding can control the surface effects such as depression, erosion, scratch and grinding teeth in the flatenning step of the grinding surface processed by chemically machinery grinding. The kit for preparing water system dispersoid for chemically machinery grinding comprises a first composition and second composition, wherein the first composition comprises white carbon black with average once grainsize of 15nm-40nm at the pH of 8-11, and the second composition comprises poly(methyl) acrylic acid and organic acid with more than two carbonyl groups at pH of 1-5.

Description

technical field [0001] The invention relates to a chemical mechanical grinding water dispersion preparation kit, a preparation method of the chemical mechanical grinding water dispersion, a chemical mechanical grinding water dispersion and a chemical mechanical grinding method. Background technique [0002] In recent years, with the high integration and multilayer wiring of semiconductor devices, planarization technology using chemical mechanical polishing has attracted attention. In the chemical mechanical polishing aqueous dispersion used for this chemical mechanical polishing, an abrasive is usually blended as an abrasive. As abrasives, various schemes have been proposed, for example: inorganic particles such as fumed silica, colloidal silica, aluminum oxide, cerium oxide; organic particles such as polymethyl methacrylate; making these particles physically Or chemically bonded organic-inorganic composite particles, etc. (for example, refer to Patent Document 1). [0003...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09K3/14H01L21/304B24B37/00B82Y10/00B82Y99/00
CPCC09G1/02C09K3/1409C09K3/1463H01L21/3212C09K3/14H01L21/304
Inventor 国谷英一郎仕田裕贵内仓和一
Owner JSR CORPORATIOON
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