Method for producing silicon chip grinding carrier

Abstract

The invention relates to a manufacturing method of a silicon chip grinding carrier, the whole manufacturing process of which is completed by plate cutting, leveling, punching shear, heat treatment, heat preservation and cooling, inspection and putting the carrier in storage. The manufacturing method of the invention is characterized in that the leveling adopts reverse rolling process; in the punching shear of gears, monolithic, rotational positioning and segmented punching shear methods are adopted to punching-shear the gears; when heat treatment is carried out to blanks, a plurality of the blanks are formed into an integral component beforehand and then heat treatment is carried out. Compared with the prior art, the method realizes a full set of carrier manufacturing method with the localization of materials, the standardization of production and the simplification of operation, thus greatly lowering the production cost and solving the technical problems that are be solved for a long time by the domestic and overseas counterparts who are engaged in the manufacture of the carrier. By adopting the manufacturing method of the invention to manufacture the carrier, not only homemade rolled hard strip steel can be selected as material, thus with no need of depending on import, but also advantages such as small accumulative error, good parallelism, proper warp degree and the stability of tolerance and low technical requirements for operation can be ensured, and carrier processing is not restricted by diameter, thus facilitating localized and standardized production.

Description

【Technical field】 [0001] The invention relates to a processing method, more specifically to a manufacturing method for carrying a silicon wafer grinding carrier in the process of manufacturing a semiconductor material silicon single wafer. 【Background technique】 [0002] Carrying silicon wafer grinding carrier (also known as planetary wheel, carrier plate), is a gear that carries silicon wafers to revolve and rotate on the grinding disc. The carrier structure is circular, its upper and lower sides are planes, the outer contour is provided with teeth, and the middle part is provided with a plurality of holes for placing silicon wafers to be ground. When in use, a plurality of grinding carrier rings are arranged on the lower grinding disc of the grinding machine, and the carrier teeth are respectively meshed with the toothed walls of the inner and outer gears in the middle and outer periphery of the lower grinding disc. During the movement, under the forward and reverse drive...

AI Technical Summary

Problems solved by technology

Although the wire electric discharge cutting method adopts electronic programming and electronic control system to control cutting, it still has the following defects: the roughness of the cutting surface exceeds the standard, and the accumulated error of the tooth shape is large, which often affects the quality of the silicon wafer to be ground

Its disadvantages are: 1. Imported materials must be selected. 2. Multiple blanks are stacked together for processing. Due to the influence of equipment and human factors, the cumulative error is large, the operator has high technical requirements, and the tolerance stability is poor, which is not conducive to standardized processing.

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