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Aqueous solution and method for removing ionic contaminants from the surface of a workpiece

A technology for aqueous solution and pollutants, which is applied in the direction of non-surface active detergent composition, organic non-surface active detergent composition, etc., to achieve the effect of reducing pollution value and concentration

Active Publication Date: 2008-08-27
ATOTECH DEUT GMBH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As a result, even after cleaning, the surface still has an undesirably high concentration of ionic contaminants which in further processing lead to the problems mentioned above

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0061] Printed circuit boards with four different solder resist masks (Taiyo PSR4000MH, Taiyo PSR 4000MP, Taiyo 4000 AUS 5, Taiyo 4000 GHP 3) were treated with a tin deposition method according to Table 1 and coated with a 1 μm thick layer of immersion tin . The tin deposition bath included tin(II) methanesulfonate, methanesulfonic acid, and thiourea. After deposition, one board of each printed circuit board was treated according to the invention, and one board was not treated according to the method of the invention (for reference).

[0062] Taking 1 liter of deionized water as a benchmark, the aqueous solution of the present invention has the following composition:

[0063] 1.5g / l guanidine carbonate (purity 98%)

[0064] 14g / l monoethanolamine (in deionized water, 850ml / l)

[0065] 1g / l isopropanol

[0066] The pH is about 10.5.

[0067] The amount of ionic contamination on these plates was then determined using standard tests. The results are listed in Table 2.

[0...

Embodiment 2

[0070] Two printed circuit boards were treated with a 1 micron thick silver layer in the vertical run method for immersion silver deposition according to Table 3, where each circuit board was coated with a solder resist mask Taiyo PSR4000MP. The silver deposition bath includes silver methanesulfonate and methanesulfonic acid. After deposition, one board of each printed circuit board type was treated according to the invention, and one board was not treated according to the method of the invention (for reference).

[0071] The amount of ionic contamination on these plates was then determined using standard tests. The results are listed in Table 4.

[0072] The results show that the degree of ion pollution can be greatly reduced by using the treatment method of the present invention. The amount of ionic contaminants was reduced by about 63%.

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PUM

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Abstract

To reduce ionic contaminants on printed circuit boards that are at least partially covered with a solder resist mask and are provided with top layers on the copper structures, an aqueous cleaning solution is used, which contains at least one ethanolamine compound and / or the salt thereof, at least one alcoholic solvent and, at need, at least one guanidine compound and / or the salt thereof.

Description

technical field [0001] The present invention relates to an aqueous solution and method for removing ionic contaminants from a workpiece surface having a solder resist mask and a surface top layer. The aqueous solution and the method are preferably used for the manufacture of circuit carriers, more particularly for the manufacture of printed circuit boards, in particular for the manufacture of contacts on circuit carriers, such as edge connector contacts and button contacts on printed circuit boards. point. Background technique [0002] During the production of the circuit carrier, organic and / or metallic layers are applied to the copper surface of the base material. These layers can perform different functions. For example, an organic layer may be used to form the copper surface, eg in a subsequent process. For this purpose, a photoresist is applied on the copper surface such that it is completely covered. Thereafter, the layer can be partially exposed to light using a d...

Claims

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Application Information

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IPC IPC(8): C11D11/00C11D7/32C11D7/26C11D7/50H05K3/26G03F7/42H01L21/306
CPCC11D7/261C11D7/3218C11D7/5013C11D7/5022G03F7/40G03F7/405G03F7/425H05K3/244H05K3/26H05K3/28H05K2201/0761H05K2203/122C11D2111/22C11D7/3272
Inventor T·贝克I·库比查H-J·施赖埃尔G·施泰因贝格尔
Owner ATOTECH DEUT GMBH
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