Lead free solder paste and application thereof
一种无铅焊膏、焊膏的技术,应用在焊接设备、焊接介质、焊接/切割介质/材料等方向,能够解决易破坏一次钎焊部、一次钎焊部熔融、Cu电极腐蚀等问题,达到良好焊料润湿性、锡球的发生量少、提高可靠性的效果
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Embodiment A
[0070] The melting point (solidus temperature and liquidus temperature) and the volume expansion rate (ratio of the volume at the liquidus temperature to the volume at the solidus temperature) at the time of melting of the solder alloys shown in Table 1 were measured. .
[0071] These solder alloy powders (average particle size: 25 to 35 μm) and flux A with the following composition (% is mass %) were mixed in the following proportions to prepare a solder paste, which was tested for self-alignment. tested. The results are shown in Table 1 together. In addition, the bisphenol A type epoxy resin used in the Example was all a liquid monomer (bis-phenol A diglycidylether (bis-phenolA diglycidylether)).
[0072] [Table 1]
[0073] No.
composition
Melting point (°C)
Expansion rate
(%)
self-alignment
NG number
(20
Among)
Bi
sn
Ag
Cu
Sb
In
...
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