Prepreg applied for multi-layer board of printed electronic circuit

Abstract

The invention pertains to the technical field of the copper clad laminate, which more particularly relates to a prepreg applied to a printing circuit multilayer board. The prepreg comprises reinforced materials and resin composite, wherein, the reinforced materials is glass fiber paper, and according to part by weight, the formulation of the resin composite is as follows: 20 to 84 portions of resin, 0 to 35 portions of filling materials, 0.01 to 0.3 portions of curing accelerator and 10 to 45 portions of solvent; the resin composite solvent is soaked in the glass fiber paper for 1 to 5 minutes, and is put in a 140 to 200 DEG C oven for baking for 2 to 10 minutes; after the solvent is removed, the prepreg applied to multilayer PCB processing materials is obtained; white flake and spot problems of base materials during the manufacturing procedures of the multilayer PCB are prevented, problems of de-lamination, shrink resin, holes and crack of the resin and white flake, etc. that come up after the multilayer PCB goes through cold and hot impact are improved, and the prepreg has good reliability and low cost.

Description

Technical field: [0001] The invention belongs to the technical field of printed circuit boards, in particular to a prepreg applied to printed circuit multilayer boards. Background technique: [0002] Copper-clad laminate is a composite material made by impregnating the reinforcing material with resin, covered with copper foil on one or both sides, and hot-pressed, referred to as copper-clad laminate (CCL), which is used to make printed circuit boards (PCB) . Printed circuit boards have become an indispensable main component for most electronic products to achieve circuit interconnection. The main materials for manufacturing printed circuit boards (PCBs) include copper clad laminates (CCL) and prepregs. Among them, copper clad laminates are mainly used to make inner core boards of multilayer circuit boards. The main function of prepregs is to convert single or multiple The core board and copper foil are bonded, and the resin composition impregnated with itself is used to fi...

AI Technical Summary

Problems solved by technology

The traditional prepreg that uses glass fiber cloth as a reinforcing material is woven with warp and weft glass fiber yarns in its production process, which makes the glass fiber cloth have the characteristics of high fiber density, high strength, and stable dimensions. However, because of these characteristics, glass fiber The dense weaving of the cloth, interweaving of warp and weft yarns, and the two-directional weaving characteristics of warp and weft gradually exposed the lack of performance and reliability of multi-layer boards, mainly manifested in: quality problems such as white spots and dried flowers on the base material after pressing the board, mechanical processing Poor performance, some structural multilayer PCB boards are prone to problems such as delamination explosion, resin shrinkage, resin void cracks, and white spots after being subjected to cold and heat shocks

It can be seen that the application of traditional prepreg multilayer boards with glass fiber cloth as a reinforcing material is prone to structural problems, and it is difficult to meet the needs of the special structure of multilayer PCBs.