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A method to rinse blots on surfaces of ceramics

A ceramic surface and stain technology, applied in the direction of cleaning methods using tools, cleaning methods using liquids, cleaning methods and utensils, etc., can solve problems that affect the process, cannot effectively remove stains, damage the surface, etc.

Inactive Publication Date: 2008-07-09
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this method, scrubbing with acetone or isopropanol can only remove some particles and reactive polymers that are easier to remove attached to the surface, but cannot remove some stains, and soaking in chemical solutions cannot effectively remove stains, and may also will damage its surface
And it is easy to introduce some impurity ions to affect the process

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0015] The following examples are used to further illustrate the method of the present invention, but are not intended to limit the present invention.

[0016] In this example, the stains on ceramic parts in the semiconductor manufacturing process are cleaned, and the reagents used include: hydrogen peroxide (H 2 o 2 , electronically pure), ammonia (NH 4 OH, electronically pure), isopropanol (IPA, analytically pure), tetramethylammonium hydroxide (TMAH, electronically pure); and deionized water, dust-free cloth, pickle cloth, 1500, 2000 mesh emery paper.

[0017] Cleaning scheme 1:

[0018] A. Wipe the ceramic surface with a dust-free cloth dipped in isopropanol for preliminary decontamination;

[0019] B. Rinse the pottery processed by step A with deionized water for 7 minutes;

[0020] C. Put the parts processed in step B into NH 4 OH:H 2 o 2 :H 2 Soak in the solution of O=1:1:3 for 25 minutes;

[0021] D. Ultrasonic cleaning the ceramics processed by step C in deio...

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PUM

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Abstract

The invention provides a method for removing the ceramic surface stains, the method firstly uses dust-free cloth to dip isopropanol to polish the ceramic surface till being colorless; the solution of NH4OH: H2O2: H2O which is equal to 1: 0.6 to 1.5 to 2 to 5 is used for soaking the ceramics after the flushing by deionized water; then the ceramics is arranged in the deionized water to carry out the ultrasonic cleaning, if the stains are not removed still, emery paper with 1500 to 2000 mesh is dipped with the solution of HCl: H2O2: H2O which is equal to 1: 2 to 4: 8 to 10 to carry out the grinding removal of the stains; finally, the deionized water is used for flushing, the N2 is used for drying, and the baking is carried out for 1.5 to 3 hours in an oven at 90 to 120 DEG C. The application of the method of the invention can effectively remove the ceramic surface pollutants, in particular to the surface stains on a ceramic part of semiconductor process equipment.

Description

technical field [0001] The invention relates to a method for cleaning ceramics, in particular to a method for cleaning stains on the surface of ceramics. Background technique [0002] Ceramics have been more and more widely used in semiconductor process equipment due to their superior performance, especially in semiconductor process processes under strong chemical atmosphere and plasma corrosion, such as chemical vapor deposition, plasma etching, TFT Process and so on. Although ceramics made of alumina are sintered or sprayed, they have good stability, but in the case of such strong chemical gas and plasma corrosion, some chemical reactions will occur on the surface of the ceramics, resulting in some reactants that pollute the ceramics surface. These generated pollutants will be unstable in the process environment, which will affect the results of the process, so they must be effectively removed. [0003] The existing method for cleaning ceramics is to scrub ceramic parts...

Claims

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Application Information

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IPC IPC(8): H01L21/00H01L21/205H01L21/3065B08B7/04B08B1/00B08B3/02B08B3/04B08B3/12C11D7/06C23C16/00C23F4/00
Inventor 钱进文
Owner BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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