Surface mounting type electronic components and manufacturing method of the same

A surface-mounted, electronic component technology, used in capacitor manufacturing, fixed capacitor parts, electrical components, etc., can solve the problems of cost, difficulty in handling, and difficulty in obtaining laminated ceramic capacitors, and achieves excellent mountability, improved Effect of Plating Adhesion

Inactive Publication Date: 2008-04-23
TAIYO YUDEN KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the above pretreatment is very difficult and costly
On the contrary, if it is desired to improve the plating adhesion of electrolytic plating, the resistivity of the conductive resin must be reduced, that is, the conductivity must be increased, so it is difficult to obtain a laminated ceramic capacitor with the desired ESR

Method used

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  • Surface mounting type electronic components and manufacturing method of the same

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Embodiment Construction

[0032] Embodiments of the surface mount type electronic component of the present invention will be described below by taking a laminated ceramic capacitor as an example. In addition, the present invention is particularly applicable to composite electronic components having a capacitor portion, such as capacitor arrays and LC filters, in addition to laminated ceramic capacitors.

[0033] Fig. 1 is a schematic longitudinal sectional view showing a multilayer ceramic capacitor of the present invention. This multilayer ceramic capacitor 1 has a structure in which a pair of external electrodes 5 are formed on an electronic component base 2 formed by alternately stacking internal electrodes 4 with a ceramic dielectric 3 mainly composed of barium titanate. . The above-mentioned external electrode 5 has a base metal layer 6 closely bonded to the electronic component substrate 2 and electrically connected to the internal electrode 4, has a first resin layer 7 formed on the base metal ...

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Abstract

One inventive aspect relates to a surface mounting type electronic component excellent in a mounting property and having desired equivalent series resistance (ESR). The component has an electronic component body, and at least a pair of terminal electrodes formed on a surface of the electronic component body. The terminal electrode has a conductive resin layer formed between a substrate metal layer and a metal plating layer. The first and second layers each comprise a curable resin and metal particles. The first layer is lower in the content of metal particles than the second layer.

Description

technical field [0001] The present invention relates to surface-mount electronic components such as laminated ceramic capacitors, capacitor arrays, and LCR composite components, and methods of manufacturing the same, as well as structures of external electrodes and methods of forming the same. Background technique [0002] A surface-mount electronic component typified by a multilayer ceramic capacitor has an electronic component base in which internal electrodes are embedded in a substantially rectangular parallelepiped base, and at least a pair of external electrodes electrically connected to the internal electrodes. The external electrodes are composed of a base metal layer connected to the internal electrodes, and a plurality of conductive layers such as a plated metal layer for protecting the base metal layer and improving solder wettability. [0003] In recent multilayer ceramic capacitors, the ratio of the internal electrodes inside the laminate has gradually increased...

Claims

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Application Information

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IPC IPC(8): H01G4/30H01G4/228H01G2/02H01G4/252H01G4/38H01G4/40
CPCH01G4/2325H01G4/005
Inventor 齐藤贤二过足光三
Owner TAIYO YUDEN KK
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