Flexible wiring circuit board, manufacturing method thereof, and imaging device

A wiring circuit substrate and manufacturing method technology, applied in printed circuit manufacturing, radiation control devices, printed circuits, etc., can solve problems such as noise and malfunction of electronic components, and achieve warpage suppression, good mountability, and excellent mountability. Effect

Pending Publication Date: 2019-12-20
NITTO DENKO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] On the other hand, it is known that in a circuit board on which electronic components such as an imaging element are mounted, malfunctions and noises of electronic components occur due to the influence of electromagnetic waves from the outside.

Method used

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  • Flexible wiring circuit board, manufacturing method thereof, and imaging device
  • Flexible wiring circuit board, manufacturing method thereof, and imaging device
  • Flexible wiring circuit board, manufacturing method thereof, and imaging device

Examples

Experimental program
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Effect test

no. 2 Embodiment approach ＞

[0204] Reference Figure 9~Figure 10C The second embodiment of the mounting board 1 will be described. In addition, in the mounting board 1 of the second embodiment, the figure 2 The same components in the first embodiment shown are denoted by the same reference numerals, and the description thereof is omitted.

[0205] In contrast to the structure of the first embodiment, the mounting substrate 1 of the second embodiment further includes a second conductor pattern 50 and a fourth insulating layer between the first insulating cover layer 6 and the anisotropic conductive adhesive layer 7 The third cover insulating layer 51.

[0206] That is, the mounting substrate 1 of the second embodiment includes an insulating base layer 4, a conductive pattern (first conductive pattern) 5, a first insulating cover layer 6, a second conductive pattern 50, a third insulating cover layer 51, and anisotropic conductive The adhesive layer 7, the shielding layer 8, and the second insulating cover la...

no. 3 Embodiment approach ＞

[0235] Reference Picture 11 The third embodiment of the mounting board 1 will be described. In addition, in the mounting board 1 of the third embodiment, the figure 2 with Picture 9 The same members of the first embodiment and the second embodiment shown are denoted by the same reference numerals, and the description thereof is omitted.

[0236] Compared with the structure of the first embodiment, the mounting substrate 1 of the third embodiment further includes a second adhesive layer as a second adhesive layer between the first insulating cover layer 6 and the anisotropic conductive adhesive layer 7. The anisotropic conductive adhesive layer 60, the second insulating base layer 61, the second conductor pattern 50 and the third insulating cover layer 51.

[0237] That is, the mounting substrate 1 of the third embodiment includes an insulating base layer 4, a conductor pattern (first conductor pattern) 5, a first insulating cover layer 6, a second anisotropic conductive adhesive...

no. 3 Embodiment approach

[0248] The third embodiment also exhibits the same effects as those of the first and second embodiments.

[0249] In particular, in the third embodiment, compared with the first embodiment, the degree of freedom of wiring design can be increased.

[0250] In addition, the mounting substrate 1 of the third embodiment includes a second anisotropic conductive adhesive layer 60 between the first wiring 12 and the second wiring 52, and the second anisotropic conductive adhesive layer 60 contains reinforcement Cellulose layer 17. Therefore, the thermal expansion coefficient of the second anisotropic conductive adhesive layer 60 decreases. Therefore, the warpage of the imaging unit 27 can be further suppressed.

[0251] In addition, the modification of the first embodiment can be similarly applied to the third embodiment.

[0252] In addition, in the mounting substrate 1 of the above embodiment, the second adhesive layer is the second anisotropic conductive adhesive layer 60. However, for ...

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Abstract

A flexible wiring circuit board is provided with a first insulating layer, first wiring arranged on one side of the first insulating layer in the thickness direction, an adhesive layer arranged on oneside of the first wiring in the thickness direction, and a second insulating layer arranged on one side of the adhesive layer in the thickness direction, wherein the adhesive layer contains a reinforcing fiber layer having insulating properties.

Description

Technical field [0001] The present invention relates to a flexible wiring circuit board, a manufacturing method of the flexible wiring circuit board, and an imaging device. Background technique [0002] Conventionally, imaging devices such as camera modules mounted on mobile phones and the like usually include: an optical lens; a housing that houses and holds the optical lens; imaging elements such as CMOS sensors and CCD sensors; and a circuit board on which the imaging element is mounted. The circuit board is used for electrical connection to external wiring. The imaging element is mounted on the substantially central part of the circuit board, and the housing is arranged to surround the imaging element on the peripheral end of the circuit board. Patent Document 1 discloses such a substrate (for example, refer to Patent Document 1). [0003] On the other hand, it is known that, in a circuit board on which electronic components such as imaging elements are mounted, malfunctions ...

Claims

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Application Information

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IPC IPC(8): H05K1/02H01L27/146H04N5/225H05K3/28H05K9/00
CPCH05K1/0366H05K3/281H05K3/323H01L27/146H04N23/00
Inventor 柴田周作河邨良广高仓隼人若木秀一
Owner NITTO DENKO CORP
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