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Heat radiator, circuit board, electronic equipment

一种电路基板、电子设备的技术，应用在电子设备,电路基板,散热器领域，能够解决厚度变薄、受热损坏、不均匀压力分布厚度等问题

Inactive Publication Date: 2008-04-16
FUJITSU CLIENT COMPUTING LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the thermal conductivity of this elastic component is low, which reduces the heat dissipation efficiency of the heating element
Therefore, in recent years, as the heating value of the heating element has increased, its thickness has to be thinned, and it has been difficult to achieve a thickness that can correct uneven pressure distribution.
In addition, when a heat sink is used to dissipate heat from multiple heating elements, it may become the cause of thermal damage due to insufficient heat dissipation of a certain heating element.

Method used

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  • Heat radiator, circuit board, electronic equipment
  • Heat radiator, circuit board, electronic equipment
  • Heat radiator, circuit board, electronic equipment

Examples

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Embodiment Construction

[0022] Hereinafter, as one aspect of the present invention, an electronic device 100 embodied as a notebook PC will be described with reference to the drawings. Here, FIG. 1 is an external perspective view of a notebook PC 100 . Referring to FIG. 1 , the electronic device 100 is, for example, embodied as a notebook PC 100, but is not limited thereto, and also includes a PDA, a handheld personal computer (handheld PC), a palm-sized personal computer (Palmsize PC), a wearable computer (wearable computer). ), electronic dictionaries, electronic stationery, game consoles, portable home appliances (such as portable TV sets, portable video tape recorders, portable DVDs) and other portable electronic devices. Also, the size of the notebook PC 100 includes A4 size, B5 size, other auxiliary notebook sizes, mini notebook sizes, and the like.

[0023] The notebook PC 100 has a PC body 110 , a hinge 120 , a display unit (LCD bezel frame) 130 , and a main board (circuit board) 140 not sho...

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PUM

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Abstract

A heat sink that radiates n exoergic circuit elements mounted on a circuit board includes a housing that has a heat-receiving surface that receives heat from the n exoergic circuit elements, and n+2 fixture parts to each of which a fixture member is attachable, each fixture member compressively fixing the housing onto the circuit board, wherein n is equal to or greater than 2, the heat sink is used to commonly radiate the n exoergic circuit elements, and a line that connects two fixture members to each other among n+2 fixture members passes between two centers of gravity of two adjacent exoergic circuit elements.

Description

technical field [0001] The present invention generally relates to heat sinks, circuit boards, and electronic equipment, and particularly relates to the fixing of heat sinks on circuit boards on which heat generating circuit elements (hereinafter referred to as "heating elements") are mounted. Here, the concept of "electronic equipment" includes, for example, notebook personal computers (hereinafter referred to as "PCs"), servers, personal digital assistants (PDAs), electronic dictionaries, electronic stationery, game machines, and the like. Background technique [0002] With the popularization of electronic devices in recent years, there has been a growing demand to provide small and high-performance electronic devices at low cost, and reduction in the number of components has been studied. Notebook PCs, which are typical examples of electronic equipment, are equipped with heat-generating components such as CPUs and chipsets, and the amount of heat generated increases with t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/40H05K7/20
CPCH01L2924/0002H01L23/4006H01L23/467H05K7/20445H05K7/20509H05K7/2049G06F1/203H01L2924/00
Inventor 熊谷实立神一树饭岛崇
Owner FUJITSU CLIENT COMPUTING LTD
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