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Felting laminate for resin and method for manufacturing laminated body using same

A manufacturing method and adhesive layer technology, applied in the direction of epoxy resin glue, printed circuit manufacturing, chemical instruments and methods, etc., can solve the problem of insufficient resin adhesion, thinner copper wiring, and resin adhesion that cannot be achieved Sufficient levels etc.

Inactive Publication Date: 2008-04-09
MEC CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] However, in the method of forming a general tin layer or copper-tin alloy layer as in Patent Documents 1 and 2 on the copper surface, there is a risk of ion migration due to dendrites.
[0010] In addition, depending on the type of resin, the tin layer or the copper-tin alloy layer may not be sufficiently effective in improving the adhesion, especially if the glass transition temperature is high, that is, if the resin is relatively hard.
[0011] Furthermore, in the method described in the above-mentioned Patent Document 3, since tin plating is performed, copper is eluted into the plating solution and the wiring becomes thinner.
[0012] In addition, even if silane treatment is performed on the surface of the usual tin or tin alloy layer as in Patent Documents 1, 2, and 4, the adhesion to the resin still cannot reach a sufficient level.
In particular, under severe conditions such as high temperature, high humidity and high pressure, the adhesion to resin may not be sufficient

Method used

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  • Felting laminate for resin and method for manufacturing laminated body using same
  • Felting laminate for resin and method for manufacturing laminated body using same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0077] (1) Determination of surface treatment and peel strength

[0078] Etch the electrolytic copper foil with a sodium persulfate aqueous solution to 2 μm to remove the chromate-treated surface of the copper foil during manufacture, expose the clean copper surface, and then immerse it in the 22% by weight of sulfuric acid, 1.8% by weight of stannous sulfate (as Sn 2+), nickel sulfate 5% by weight (as Ni 2+ ), 15% by weight of thiourea, 2% by weight of copper sulfate, 30% by weight of diethylene glycol, and ion-exchanged water as the remainder, followed by water washing and drying.

[0079] Resin for laminated circuit boards with copper foil on one side of the obtained copper foil (resin with copper foil "ABF-SHC" manufactured by Ajinomoto Co., Ltd., glass transition temperature Tg(TMA) = 165°C) , while heating and pressurizing. The peel strength of the copper foil of the obtained laminate was measured according to JIS C 6481, and is shown in Table 1.

[0080] (2) The sha...

Embodiment 2、3

[0085] It carried out similarly to Example 1 except having changed the processing liquid as shown in following Table 1. The results are shown in Table 1.

Embodiment 4

[0093] At room temperature, spray 5% by weight of copper foil on both sides of a glass cloth epoxy resin impregnated copper-clad laminate (FR4 grade, glass transition temperature Tg(TMA) = 125°C) with a thickness of 18 μm copper foil on both sides. Hydrochloric acid for 10 seconds to wash, then wash with water and dry.

[0094] Next, it was immersed in the aqueous solution of Example 1 at 30° C. for 30 seconds, washed with water, and dried. While stirring the 1 wt% aqueous acetic acid solution, a small amount of 1 wt% 3-glycidoxypropyltrimethoxysilane was added, and the stirring was continued for 1 hour to obtain a colorless transparent liquid. The copper-clad laminate treated as above was dipped in the aqueous solution, shaken for 30 seconds, then pulled up slowly to fully remove the aqueous solution. After that, it was put in an oven at 100° C. without washing with water, and dried for 30 minutes.

[0095] Next, in order to evaluate the adhesiveness between the obtained la...

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Abstract

The invention provides a sticking layer according to resin, that fully adhesion of the resin to the copper or copper-alloy can be obtained, and the problem of ion migration caused by dendrite in the tin or tin-alloy layer before, with adhesion improvement to the resin of high glass transition temperature. The invention also provides the manufacturing method which uses the sticking layer. The sticking layer according to the resin is used to bond resin and copper or copper-alloy layer, which is also constituted by copper or copper-alloy. The sticking layer according to the resin is made of a metal layer which has great particles of copper or copper-alloy concentrated, with space existed among particles and coralliform of complex micro-holes existed on the surface. The average diameter of the micro-holes is from 10nanometer to 200nanometer, and more than two micro-holes is exsited on the surface of the metal layer per 1 micron2 in average.

Description

technical field [0001] The present invention relates to an adhesive layer for resin for achieving adhesion between a resin and a copper or copper alloy layer, and a method for producing a laminate using the same. More specifically, it relates to an adhesive layer on a copper surface used in various electronic components such as printed circuit boards, semiconductor package parts, liquid crystal displays, and electroluminescence to resins, and a method for producing a laminate using the same. Background technique [0002] A general multilayer circuit board is manufactured by laminating an inner substrate having a conductive layer made of copper on its surface with another inner substrate or copper foil layer via a prepreg. Conductive layers are electrically connected through through-holes whose walls are plated with copper, called through-holes. Needle-shaped copper oxide called black oxide or brown oxide is formed on the copper surface of the above-mentioned inner layer sub...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J11/06B32B7/12B32B15/08
CPCB32B15/08H05K3/384H05K2203/0307H05K3/389H05K2203/072H05K2201/0116C08J5/12Y10T428/24999B32B7/04
Inventor 河口睦行齐藤知志出口政史天谷刚
Owner MEC CO LTD
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