Curing composition for nano-imprint lithography and pattern forming method using the same

Abstract

The invention provides a good combination which has the photocurablity, sealing property, mold release, residual film, pattern figure, coating properties and the etching adaptation. The invention adopts a curable combination used for nano impressing photoetching, which is characterized by comprising 88-99 mass% of polymerized unsaturated monomer, 0.1-11 mass% of photopolymerization initiator and at least one of a 0.001-5 mass% of surfactant containing fluorin, a siloxane surfactant and a fluorin-siloxane surfactant. The polymerized unsaturated monomer comprises one 1-functional group polymerized unsaturated monomer of not less than 10 mass%, wherein the 1-functional group polymerized unsaturated monomer has a portion containing the olefinic unsaturated bond and a portion containing at least a heteroatom.

Description

technical field [0001] The present invention relates to a curable composition for nanoimprint lithography and a pattern forming method using the same. Background technique [0002] The nanoimprint method is a technology that develops the embossing technology known in optical disc manufacturing, and presses a metal mold prototype (generally called a mold, master plate, template, etc.) formed with a concave-convex pattern onto a resist, Make it mechanically deform, and transfer the fine pattern precisely. Once the mold is made, nanostructures can be easily and repeatedly molded, so it is economical, and since it is a nanofabrication technology with less harmful waste and discharge, it is expected to be applied to various fields in recent years. [0003] In the nanoimprint method, there are two proposals: that is, the case of using thermoplastic resin as the material to be processed (S.Chou et al.: Appl.Phys.Lett Vol.67, 3114 (1995)) and the case of using nanoimprint Case of ...

AI Technical Summary

Problems solved by technology

In the coating method of spinning after dripping at the center, although good coating uniformity can be obtained, for example, when using a large substrate with an angle of 1 m, the anti-corrosion film that is shaken off during rotation (during rotation) is discarded. The amount of etchant is quite large, and in addition, the cracking of the substrate caused by high-speed rotation and the problem of ensuring the production tact time (tact time)

In addition, there is a problem that since the coating performance in the method of spinning after dripping at the center depends on the rotation speed during rotation and the coating amount of the resist, it should be further applied to the fifth-generation substrate that is being enlarged. , there is no general-purpose motor that can provide the required acceleration, and when such a motor is specially ordered, the component cost increases

[0036] However, the curable composition for nanoimprint lithography used in nanoimprint is technically Difficulty further increased

[0037] (4) When a hydrophobic resist film is used in order to improve the peelability with the mold, the wettability of the etching solution and the resist is further deteriorated, and etching residues are easily generated;

[0038] (5) Since the curable composition for nanoimprint lithography adopts a three-dimensional network structure, it is difficult to peel off compared with a positive resist. In addition, when the network structure is made stronger, although the etching resistance is improved Improves, but becomes more difficult to peel off;

[0040] As for the curable composition for nanoimprint lithography used in nanoimprint, various materials have been disclosed, but none of them have been used in the photolithography process, etching process, and lift-off process of nanoimprinting. Disclosure of nanoimprint materials suitable for use in all processes and guidelines for material design

In addition, curable compositions for nanoimprint lithography known to date for use in inkjet compositions and protective films for magneto-optical disks have common materials in the photolithography process, but do not have the etching process and peeling process. process, which is very different from etching resist

Therefore, when the photocurable resin used in these applications is directly used as an etching resist, problems often arise in the etching process and the peeling process.

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