Photo- and thermo-curable resin composition

Abstract

The invention provides a photo- and thermo-curable resin composition, which has the advantages of excellent light cured property and excellent thermally cured property. The composition is irradiated, part of the composition is not irradiated, then the composition is heated, the composition including the non-cured part is completely cured, a cured object with a high bonding strength is formed, and the stability of the cured object is good during the storage. The provided resin composition comprises (1) a compound containing a (methyl)acryloyl group; (2) a polyene compound wherein one molecule of the polyene compound comprises at least two vinyl groups or allyl groups; (3) a polymercaptan compound, wherein one molecule of the polymercaptan compound comprises at least two thiol groups; (4) an optical free radical generator; (5) a heat free radical generator; and (6) a heat negative ion polymerization initiator.

Description

technical field [0001] This invention relates to light and heat curable resin compositions. Background technique [0002] In recent years, along with the reduction in thickness of portable devices such as smartphones, camera modules mounted in portable devices such as smartphones have been gradually reduced in size. In addition, it is assumed that a camera module is mounted on a wearable device, and demands for miniaturization and thinning are increasing. Furthermore, as the size of the camera module is reduced, the parts for bonding and fixing the structural members of the camera module become finer. Therefore, the impact resistance of the camera module against dropping has become a very important issue. That is, even if the camera module is subjected to an impact caused by a drop, the bonding must be maintained even if the bonding area between the structural members is small. If the bonding area is small, the bonded parts of the structural members will be easily peeled of...

AI Technical Summary

Problems solved by technology

However, although ultraviolet curable adhesives can be cured quickly, they have the following disadvantages: curing strain due to curing shrinkage occurs, or they cannot be used for bonding parts that cannot be irradiated with light. pick up; wait

On the other hand, for thermosetting epoxy resin adhesives, although it is a low-temperature short-time curing type adhesive, it is necessary to fix the bonded members (components) with jigs and devices in order to maintain the bonding posture during bonding. ), in addition, due to the increase in temperature due to heating, the viscosity decreases, causing the following problems: sagging (タレ) occurs immediately before curing, or it flows out of the desired part, etc., and it is not always possible to make people are satisfied

However, even if such an adhesive is used, there is a problem that, in the structure of the camera module, there are parts where light is difficult to reach inside the module. In such a part, the photocurable component will not be cured. Only by heat curing, it is not completely cured, and sufficient adhesive strength cannot be ensured, or because sufficient adhesive strength cannot be ensured, there is a problem that the member (part) deviates from the target arrangement position, or the cured product The uncured components in it become the main cause of outgassing (outgas), etc., which may not be satisfactory

In addition, the storage stability cannot be said to be good, and the improvement of the storage stability can also be cited as a problem to be solved.