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Method for realizing selectivity metallization on glass surface by femto-second laser

A femtosecond laser, glass surface technology, applied in the field of glass metallization and femtosecond laser micromachining, can solve problems to be improved, achieve good selectivity and adhesion, high processing accuracy, good compatibility Effect

Inactive Publication Date: 2008-02-13
SHANGHAI INST OF OPTICS & FINE MECHANICS CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the good selectivity of laser direct writing technology, various metallization methods based on it have emerged, such as laser-induced forward transfer deposition, laser-assisted chemical vapor deposition, laser-induced plasma-assisted ablation, laser-assisted Chemical liquid deposition, laser direct writing of metal powder on the glass surface, etc., but using the above-mentioned technologies for selective metallization integrates electrical and thermal functions into micro-optics-microfluidic integrated devices fabricated by femtosecond laser micromachining. and compatibility needs to be improved

Method used

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  • Method for realizing selectivity metallization on glass surface by femto-second laser

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Experimental program
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Effect test

Embodiment 1

[0040] The concentration of the silver nitrate solution used for immersion is 0.5mol / l, and the immersion time is 10min; when the femtosecond laser directly writes patterns on the silver nitrate film, its wavelength is 800nm, the pulse width is 40fs, and the peak power density is 2.4×10 15 W / cm 2 , the scanning speed is 60μm / s; the solvent used to remove the unirradiated silver nitrate film is acetone→alcohol→distilled water in sequence, and the cleaning time of each solvent is 3min, and ultrasonic wave is used as an auxiliary means; the composition of the electroless copper plating solution is copper sulfate (CuSO 4 ·5H 2 O) 5g / l, sodium ethylenediaminetetraacetate (EDTA 2Na) 14g / l, formaldehyde (HCHO) 5g / l, 2-2'bipyridine 0.02g / l, polyethylene glycol (PEG4000) 0.05g / l l. The pH value is 12.5 (adjusted by 1% NaOH solution); the plating time is 45 minutes, and the plating temperature is 40°C. Experiments show that the Cu thin film is conductive (to achieve selective metalli...

Embodiment 2

[0042] The concentration of the fresh silver nitrate solution used for immersion is 1mol / l, and the immersion time is 10min; when the femtosecond laser directly writes patterns on the silver nitrate film, the wavelength is 800nm, the pulse width is 40fs, and the peak power density is 4.0×10 15 W / cm 2 , the scanning speed is 60μm / s; the solvent used to remove the unirradiated silver nitrate film is acetone→alcohol→distilled water in sequence, and the cleaning time of each solvent is 3min, and ultrasonic wave is used as an auxiliary means; the composition of the electroless copper plating solution is copper sulfate (CuSO 4 ·5H 2O) 7.5g / l, sodium ethylenediaminetetraacetate (EDTA 2Na) 14g / l, formaldehyde (HCHO) 7.5g / l, 2-2'bipyridine 0.03g / l, polyethylene glycol (PEG4000) 0.05 g / l. The pH value is 12.5 (adjusted by 1% NaOH solution); the plating time is 30 minutes, and the plating temperature is 40°C. Experiments show that the Cu thin film conducts electricity (to achieve sele...

Embodiment 3

[0044] The concentration of the silver nitrate solution used for immersion is 1mol / l, and the immersion time is 20min; when the femtosecond laser directly writes patterns on the silver nitrate film, the wavelength is 800nm, the pulse width is 40fs, and the peak power density is 6.4×10 15 W / cm 2 , scanning speed 60μm / s; the solvent used to remove the unirradiated silver nitrate film is acetone→alcohol→distilled water in turn, and the cleaning time of each solvent is 5min, and ultrasonic wave is used as an auxiliary means; the composition of the electroless copper plating solution is: copper sulfate (CuSO 4 ·5H 2 O) 5g / l, sodium ethylenediaminetetraacetate (EDTA 2Na) 14g / l, formaldehyde (HCHO) 5g / l, 2-2'bipyridine 0.03g / l, polyethylene glycol (PEG4000) 0.05g / l l. The pH value is 12.5 (adjusted by 1% NaOH solution); the plating time is 15 minutes, and the plating temperature is 50°C. Experiments show that the Cu thin film is conductive (to achieve selective metallization of th...

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Abstract

The present invention discloses a method using the flying-second laser to realize the selective metal on the glass surface, which comprises the following steps: (1) a silver nitrate film is prepared on the glass base; (2) the method uses the flying-second laser focalized on the silver nitrate film to draw the design; (3) the method wipes off the silver nitrate film not being radiated; (4) the method adds the chemical copperizing liquid to make chemical copperizing. Compared with the traditional metal method, the present invention is with much simpler design, much faster preparation process and more controllable technical and so on. The method is with much greater application potential and practical value in the multi-functional chip experiment and the integration of the micro-component, in particular to the effective integration of the electricityl function and calorifics function.

Description

technical field [0001] The invention relates to glass metallization and femtosecond laser micromachining, in particular to a method for realizing maskless selective metallization of glass surface by adopting femtosecond laser. technical background [0002] In recent years, the microstructure modification of glass and other transparent materials by using the ultra-fast and ultra-fast properties of femtosecond lasers has aroused great interest in the fields of physics, materials, and biology. Especially near the destruction threshold of selected materials, femtosecond lasers enable efficient nanofabrication. Since Hirao's research group first discovered femtosecond laser-induced refractive index changes and fabricated optical waveguides, femtosecond lasers have been widely used in micromachining of integrated microdevices. The urgent needs of the current lab-on-a-chip, especially the integration of micro-optics and micro-fluidics, have brought new ideas for femtosecond laser ...

Claims

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Application Information

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IPC IPC(8): C03C17/06
Inventor 徐剑程亚廖洋徐至展
Owner SHANGHAI INST OF OPTICS & FINE MECHANICS CHINESE ACAD OF SCI
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