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Method for implementing variable air quantity zone control and system frame thereof

A technology of partition control and system framework, applied in cooling/ventilation/heating renovation, instruments, electrical and digital data processing, etc., it can solve the problems of excessively uniform cooling air flow and insufficient control of air volume in the slot, so as to reduce the speed and improve the heat dissipation. Efficiency, the effect of reducing system noise

Inactive Publication Date: 2008-01-23
ZTE CORP
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a method and system framework for variable air volume zone control, to solve the problem of heat dissipation and system noise balance that can only be achieved by controlling the fan speed in the existing standard technology, and to overcome the gaps existing in the prior art. Problems and defects that the heat dissipation airflow is too uniform, and the air volume control for the empty slots and the slots of the node boards that are not powered on is not enough.

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  • Method for implementing variable air quantity zone control and system frame thereof
  • Method for implementing variable air quantity zone control and system frame thereof
  • Method for implementing variable air quantity zone control and system frame thereof

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Embodiment Construction

[0035] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be described in detail below with reference to the accompanying drawings and specific embodiments.

[0036] The present invention provides a method for variable air volume zone control and a system framework for applying the method. The system framework includes the following modules:

[0037] A. IPMC (Intelligent Platform Management Controller) sub-card module;

[0038] B. Fan control module;

[0039] C. Chassis management module;

[0040] Also includes:

[0041] D. Variable air volume zone control device;

[0042]Among them, modules A, B, and C are all standard modules defined by the existing ATCA specification, and they are also required modules. It is independently located on each ATCA node board, realizes the single board management function specified by PICMG3.0, measures and monitors the status of the node board, records event logs, and ...

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Abstract

The utility model provides a method and a system frame for realizing the variable air volume zone control. The system frame is provided with a fan control module, a case control module and a plurality of system frames which can be equipped with the nodal single board slot. The method consists of the step I: the nodal single board on each slot corresponds to the engaged position which is divided into the different separated regions. As corresponding with the separated regions, the variable air volume zone control apparatus with the air heading and the air volume functions are available; step II: after the case control module starts up, the information from the nodal single board and each separated region can be obtained via the intelligent platform supervisory controller which is arranged on each nodal single board; the step III. Based on the above information, the case control module can control the air volume and air heading of the separated region via the fan control module and the zone control apparatus. The utility model can realize the dynamic measurement for the temperature in each nodal plate. As the sub-zone is distributed with the air volume, both the fan speed and the system noise are reduced, so as to improve the reliability of the system.

Description

technical field [0001] The invention relates to the field of thermal design of an ATCA (Advanced Telecommunications Computer Architecture) platform, in particular to the variable air volume partition control technology of a single board slot. Background technique [0002] Because the ATCA system is a high-performance, scalable, and reliable architecture with powerful processing capabilities, the corresponding energy consumption is also increased. At the same time, because of the high board density, the power consumption of each node board reaches 200 watts, plus Fans, rear boards, etc., a 19-inch chassis consume a total of more than 3,000 watts, which puts high demands on system heat dissipation. [0003] The 3.0 specification formulated by PICMG (PCI Industrial Computer Manufacturers Organization) defines the overall architecture including front-plug node boards, rear plug-in boards, and chassis cooperation, and the functions stipulated by the NEBS (Network Equipment Buildi...

Claims

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Application Information

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IPC IPC(8): G06F1/20H05K7/20
Inventor 孙国华田俊王云
Owner ZTE CORP
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