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Electronic component, multilayer ceramic capacitor, and method for fabricating same

A technology of ceramic capacitors and electronic components, which is applied in the direction of multilayer capacitors, capacitors, fixed capacitors, etc., can solve the problem of difficulty in continuously forming electrode layers, difficulty in miniaturization and large capacity of multilayer ceramic capacitors, and the electrostatic capacity of multilayer ceramic capacitors. Easy to reduce and other problems, to achieve the effect of suppressing the reduction of electrostatic capacity

Inactive Publication Date: 2007-11-21
TDK CORPARATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As a result, it is difficult to continuously form internal electrode layers after sintering
As mentioned above, if the internal electrode layer is discontinuous after sintering, the capacitance of the multilayer ceramic capacitor tends to decrease
This tendency is particularly noticeable when the pre-sintering internal electrode layer is thinned, such as when the pre-sintering internal electrode layer is formed from a metal thin film obtained by a thin film forming method, and it is difficult to achieve miniaturization and increase in capacity of the multilayer ceramic capacitor.

Method used

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  • Electronic component, multilayer ceramic capacitor, and method for fabricating same
  • Electronic component, multilayer ceramic capacitor, and method for fabricating same
  • Electronic component, multilayer ceramic capacitor, and method for fabricating same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0127] Preparation of each paste

[0128] First, the BaTiO 3 Powder (BT-02 / Sakai Chemical Industry Co., Ltd.) and MgCO 3 , MnCO 3 , (Ba 0.6 Ca 0.4) SiO 3 And selected from rare earths (Gd 2 o 3 , Tb 4 o 7 、Dy 2 o 3 、Ho 2 o 3 、Er 2 o 3 、Tm 2 o 3 , Yb 2 o 3 、Lu 2 o 3 , Y 2 o 3 ) powder was wet-mixed by ball milling for 16 hours, and then dried to make a dielectric material. The average particle diameter of these raw material powders is 0.1-1 μm. (Ba 0.6 Ca 0.4 ) SiO 3 is the BaCO 3 , CaCO 3 and SiO 2 It was wet-mixed by ball milling for 16 hours, dried and sintered in air at 1150° C., and then wet pulverized by ball milling for 100 hours.

[0129] In order to form the obtained dielectric material into a paste, the organic vehicle was added to the dielectric material and mixed by a ball mill to obtain a paste for dielectric green sheets. The organic vehicle is, relative to 100 parts by mass of the dielectric material, polyvinyl butyral as a binder: ...

Embodiment 2

[0181] The dielectric green sheet paste prepared in Example 1 was coated on a PET film (carrier sheet) using a wire bar coater, and then dried to obtain a green sheet 10a. The same procedure as in Example 1 was carried out. In this method, a pre-sintered internal electrode thin film 12a is formed on the green sheet 10a to prepare a laminate as shown in FIG. 8 . Next, the PET film was peeled off from the laminate to prepare a pre-sintered sample composed of the green sheet 10a and the internal electrode film 12a, and the pre-sintered sample was subjected to binder removal, sintering, and sintering in the same manner as in Example 1. Annealing is performed to prepare a sample for surface observation after sintering including the dielectric layer 10 and the internal electrode layer 12 .

[0182] Next, the obtained sample for surface observation was observed by SEM from a direction perpendicular to the surface on which the internal electrode layer 12 was formed, and the internal e...

Embodiment 3

[0186] MgO, Al 2 o 3 , SiO 2 , CaO, TiO 2 , V 2 o 3 , MnO, SrO, Y 2 o 3 , ZrO 2 , Nb 2 o 5 , BaO, HfO 2 , La 2 o 3 、Gd 2 o 3 , Tb 4 o 7 、Dy 2 o 3 、Ho 2 o 3 、Er 2 o 3 、Tm 2 o 3 , Yb 2 o 3 、Lu 2 o 3 , CaTiO 3 or SrTiO 3 instead of BaTiO 3 , except that the sample was obtained in the same manner as in Example 1. The thickness t1 of the metal thin film 40 of each of the above-mentioned samples is 0.4 μm, and the thicknesses t2a and t2b of the dielectric thin films 42a and 42b are respectively 0.05 μm, that is, the total thickness t2 (t2=t2a+t2b) of the dielectric thin films 42a and 42b is 0.1 μm. . The electrical characteristics (capacitance C, dielectric loss tan δ) of each sample were evaluated in the same manner as in Example 1. The results are shown in Table 2.

[0187]

sample

Numbering

dielectric thin

film 42a,

Group 42b

become

Metal film 40

Thickness t1[μm]

Dielect...

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Abstract

An electronic component such as a multilayer ceramic capacitor and its fabricating method in which lowering of capacitance can be suppressed effectively even when each inner electrode layer is made thin by suppressing growth of metal particles in the sintering stage, thereby preventing the inner electrode layer effectively from becoming spherical to be broken off. The method for fabricating an electronic component having an inner electrode layer (12) and a dielectric layer (10) comprises a step for forming a pre-sintering inner electrode thin film (12a) having dielectric thin films (42a, 42b) and a metal thin film (40), a step for laying a green sheet (10a) which is to be the dielectric layer (10) after sintering and the inner electrode thin film (12a) in layers, and a step for sintering the green sheet (10a) and the inner electrode thin film (12a).

Description

technical field [0001] The present invention relates to an electronic component, a multilayer ceramic capacitor and a preparation method thereof, and particularly relates to an electronic component and a multilayer ceramic capacitor suitable for thinning and miniaturization. Background technique [0002] As an example of an electronic part, a laminated ceramic capacitor is composed of an element body of a laminated structure in which a dielectric layer and an internal electrode layer alternate with each other and a pair of external terminal electrodes formed at both ends of the element body. It is configured in multiple layers. [0003] This multilayer ceramic capacitor is produced as follows: First, the pre-sintering dielectric layer and the pre-sintering internal electrode layer are alternately laminated in the required number of sheets to manufacture the pre-sintering element body, then, this is sintered, and then the sintered element Both ends of the body form a pair o...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01G4/12H01G4/30H01G4/008
CPCH01G4/12Y10T29/417H01G4/0085H01G4/30
Inventor 铃木和孝佐藤茂树
Owner TDK CORPARATION
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