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Electrolytic copper foil with low-contour and high property and producing method thereof

An electrolytic copper foil, high-performance technology, applied in the electrolytic process, electroforming, printed circuit components, etc., can solve the problems of low roughness, undercorrosion, etc., to reduce rough surface roughness, increase crystal density, extend rate-enhancing effect

Active Publication Date: 2007-11-07
湖北中科铜箔科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to provide a low-profile high-performance electrolytic copper foil and its preparation method, through reasonable configuration of electrolyte composition and electrodeposition process parameters, and adding reasonable organic additives, to solve the current problem of more than 8500A per square meter The roughness problem of large-scale production, in order to realize the preparation of low-profile electrolytic copper foil with low roughness and stable performance, completely solve the quality problems such as "bottom corrosion" caused by the production of fine lines

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0014] Embodiment 1 of the present invention: The present invention adopts a direct current electrodeposition process, which is realized by rationally matching the composition of the electrolyte with the parameters of the electrodeposition process, and adding organic mixed additives during the electrolysis process. The process is as follows:

[0015] The concentration of copper in the electrolyte is 70-80g / L, H 2 SO 4 The concentration is 100~110g / L, Cl - The parameters of 40±10ppm are matched, T50~55℃, and organic mixed additives are added to the electrolysis equipment to make the flow rate 35m 3 / h, the current density is 8500A / m 2 Conduct electrodeposition.

[0016] The organic mixed additive is composed of: SP (sodium polydithiodipropane sulfonate) 100-200 mg / L, polyethylene glycol 20-30 ml / L, gelatin 1-3 g / L, cellulose 1-5 g / L, Triisopropanolamine 3-4ml / L.

[0017] The low-profile high-performance electrolytic copper foil prepared by the examples has equiaxed pyramid...

Embodiment 2

[0018] Embodiment 2 of the present invention: adopt electrolyte copper concentration 85~95g / L, H 2 SO 4 The concentration is 90~100g / L, Cl - The parameters of 40±10ppm are matched, T55~60℃, and organic mixed additives are added to the electrolysis equipment to make the flow rate 40m 3 / h, the current density is 9000A / m 2 Conduct electrodeposition.

[0019] The organic mixed additive is composed of: SP (sodium polydithiodipropane sulfonate) 350-500 mg / L, polyethylene glycol 35-50 ml / L, gelatin 2-3 g / L, cellulose 2-3 g / L, Triisopropanolamine 4-5ml / L.

[0020] The prepared low-profile high-performance electrolytic copper foil has equiaxed pyramid-shaped crystal grains on the rough surface, and the rough surface roughness RZ≤2.37μm, the thickness is 18μm, the peel strength of the wool foil is ≥0.48kg / cm, and the tensile strength ≥338MPa, elongation ≥6.3%.

Embodiment 3

[0021] Embodiment 3 of the present invention: adopt electrolyte solution copper concentration 100~120g / L, H 2 SO 4 Concentration is 60~80g / L, Cl - The parameters of 40±10ppm are matched, T58~60℃, and organic mixed additives are added to the electrolysis equipment to make the flow rate 50m 3 / h, the current density is 10000A / m 2 Conduct electrodeposition.

[0022] The organic mixed additive is composed of: SP (sodium polydithiodipropane sulfonate) 500-750mg / L, polyethylene glycol 50-75ml / L, gelatin 2-3g / L, cellulose 2-3g / L, Triisopropanolamine 5-8ml / L.

[0023] The prepared low-profile high-performance electrolytic copper foil has equiaxed pyramid-shaped crystal grains on the rough surface, and the rough surface roughness RZ≤2.15μm, the thickness is 18μm, the peel strength of the wool foil is ≥0.65kg / cm, and the tensile strength ≥353MPa, elongation ≥7%.

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Abstract

The present invention discloses one kind of low roughness and high performance electrolytic copper foil with surface crystal grains in equiaxial pyramid form, surface roughness not greater than 2.5 micron, thickness of 18 micron, peel strength not lower than 0.45 kg / cm, tensile strength not lower than 330 MPa and elongation not lower than 6 %. The present invention discloses also the preparation process of the electrolytic copper foil, and prepares electrolytic copper foil through a DC electrodeposit process with electrolyte with proper composition and added mixed organic additive and reasonable electrodeposit technological parameters. The electrolytic copper foil has low roughness and stable and high performance, and may be used in preparing fine circuit.

Description

technical field [0001] The invention relates to a low-profile and high-performance electrolytic copper foil and a preparation method of the electrolytic copper foil, belonging to the technical field of electrolytic copper foil. Background technique [0002] Copper foil can be divided into calendered copper foil and electrolytic copper foil according to different preparation processes. Electrolytic copper foil is the basic raw material of the electronics industry and is mainly used in multilayer printed circuit boards and polymer lithium battery industries. With the development of 3G products such as electronics, information and communication in the direction of wireless and portability, and the high performance of products are also moving towards the goal of "light, thin, short and small", the electrolytic copper foil industry urgently needs to improve the technical level The high-performance electrolytic copper foil technology is still in its "infancy", so it has broad mark...

Claims

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Application Information

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IPC IPC(8): C25D1/04H05K1/09
Inventor 张东石晨张晓鹤胡天庆
Owner 湖北中科铜箔科技有限公司
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