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Polishing diamond block with metal binder and its making process

A metal bond, diamond technology, applied in metal processing equipment, grinding/polishing equipment, manufacturing tools, etc., can solve the problems of complex diamond polishing blocks, many wastes, long production cycle, etc., to achieve easy product quality assurance , The preparation process is simple and the effect of reducing the number of replacements

Inactive Publication Date: 2007-11-07
DITIANTAI NEW MATERIAL TECHN FOSHAN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] At present, for the smoothing and polishing of ceramic tiles, stone materials, glass products (including glass-ceramics), ordinary magnesite polishing blocks using silicon carbide as abrasives are widely used. The main disadvantages of this type of polishing blocks are: high consumption, waste Lots of materials, heavy environmental pollution; low efficiency, high cost of products produced; weak cutting force, high energy consumption; short service life, frequent replacement, high labor intensity
The above-mentioned existing methods for preparing diamond polishing blocks are relatively complicated and the production efficiency is low; the production of polishing blocks uses resin, which requires secondary curing, and the production cycle is long
Moreover, the metal-bonded diamond polishing block in the prior art is also easy to grind and undercut the processed product, and the products such as ceramics are often damaged, and the phenomenon of the polishing block falling off the cutter head is also more serious.

Method used

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  • Polishing diamond block with metal binder and its making process

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] Binder composition: Al: 37% Cu: 21% Ag: 13%

[0025] Ti: 10% Zn: 10% Mg: 4%

[0026] Other materials 5%

[0027] Transition layer composition: Al: 80% Cu: 20%

[0028] Mounting part: Al: 80% Cu: 20%

[0029] Diamond: particle size 140 / 170, concentration 60%

[0030] Its preparation method is: according to the above-mentioned binder composition and diamond polishing block specifications, weigh the corresponding powder respectively, add the required concentration of diamond, add an appropriate amount of paraffin, fully mix it on the mixer for 24 hours, and set it aside; put the transition layer and the card Part of the powder is mixed evenly in proportion and set aside.

[0031] Put 1000g of uniformly mixed powder into the bottom layer of the mold and spread it; add 200g of transition layer powder and spread it; add 300g of powder for the clamping part and spread it; put it into an atmosphere-protected sintering furnace for hot pressing and...

Embodiment 2

[0034] Binder composition: Al: 30% Mg: 37% Ti: 10%

[0035] Zn: 10% Cu: 10%

[0036] 3% for other materials

[0037] Transition layer composition: Al: 80% Mg: 20%

[0038] Mounting part: Al: 80% Cu: 20%

[0039] Diamond: particle size 140 / 170, concentration 60%

[0040] Weigh the corresponding powder according to the above-mentioned binder composition and diamond polishing block specifications, add the required concentration of diamond, add an appropriate amount of paraffin, fully mix it on the mixer for 24 hours, and set it aside; Mix well and set aside.

[0041] Put 600g of uniformly mixed powder into the bottom layer of the mold and spread it; add 155g of transition layer powder and spread it; add 300g of powder for the clamping part and spread it; put it into a cold press to form under a pressure of 150MPa, demould, and sinter Pressureless sintering in the furnace, the sintering temperature is 650°C, and the temperature is kept for 60 minut...

Embodiment 3

[0043] Binder composition: Al: 50% Si: 17% Ti: 10%

[0044] Sn: 10% Cu: 10%

[0045] 3% for other materials

[0046] Transition layer composition: Al: 80% Mg: 20%

[0047] Mounting part: LY12 alloy

[0048] Diamond: particle size 100 / 120, concentration 35%

[0049] Weigh the corresponding powder according to the above-mentioned binder composition and diamond polishing block specifications, add the required concentration of diamond, add an appropriate amount of paraffin, fully mix on the mixer for 24 hours, and set aside; mix the transition layer powder in proportion, and set aside .

[0050] Put 600g of uniformly mixed powder into the bottom layer of the mold with raised ribs and spread it; add 155g of transition layer powder and spread it; add the processed LY12 alloy clamping part; put it into a press and press it under 15MPa pressure Sintering, the sintering temperature is 650°C, and the temperature is kept for 60 minutes. After the sintering ...

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Abstract

The polishing diamond block with metal binder includes one grinding layer, one transition layer and one assembling layer, and features the grinding layer including metal binder and diamond crystal once formed integrally and with slots and holes, and the assembling layer in a tail structure. The present invention has no environmental pollution, low power consumption, high efficiency, long service life and stable product quality, and is suitable for grinding and polishing ceramic tile, stone and glass product.

Description

Technical field: [0001] The invention relates to the technical field of ceramics, stone or glass processing, in particular to a metal-bonded diamond polishing block used for processing ceramics, stone or glass. Background technique: [0002] At present, for the smoothing and polishing of ceramic tiles, stone materials, glass products (including glass-ceramics), ordinary magnesite polishing blocks using silicon carbide as abrasives are widely used. The main disadvantages of this type of polishing blocks are: high consumption, waste There are many materials and large environmental pollution; low efficiency and high product cost; weak cutting force and high energy consumption; short service life, frequent replacement and high labor intensity. [0003] In order to overcome the deficiencies of ordinary magnesite polishing blocks, people try to use metal bond polishing blocks. There are two ways to prepare the diamond polishing block in the prior art: (1) the polishing block is c...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24D3/10B24D7/18B24D18/00
Inventor 王双喜耿彪刘雪敬游锡斌
Owner DITIANTAI NEW MATERIAL TECHN FOSHAN
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