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Activating process for nonmetal basal body chemical plating

An electroless plating, non-metallic technology, applied in metal material coating process, liquid chemical plating, coating, etc., can solve the problems of tin ion interference, complicated operation, unstable activation solution, etc., and achieve convenient operation and practicability wide effect

Inactive Publication Date: 2007-10-17
扬州华宇管件有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The purpose of the present invention is to solve the shortcomings of the traditional colloidal palladium activation process, such as unstable activation solution, tin ion interference, and complicated operation. The present invention provides an improved colloidal palladium process

Method used

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  • Activating process for nonmetal basal body chemical plating
  • Activating process for nonmetal basal body chemical plating
  • Activating process for nonmetal basal body chemical plating

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] (1). Preparation of activation solution: 0.08gPdCl 2 Add to 10ml of aqueous solution, shake well, adjust PdCl with 40ml of 1M NaOH solution 2 The pH value of the solution was brought to 10, and ultrasonically oscillated for 2 hours. During this process, PdCl 2 After hydrolysis, it reacts with NaOH to form a colloid, and finally obtains a stable colloid with a pH value of 6, in which the palladium content is 0.005 mol / L.

[0024](2). Activation: Immerse the washed and dried porous ceramic substrate in the above-mentioned colloid, take it out when the substrate turns orange and the color distribution is relatively uniform, and the solution blown to the surface of the carrier with a hair dryer no longer flows, and put it in hydrogen Under atmosphere, reduce at 50°C for 3h until the orange matrix turns black.

[0025] (3). Use electroless plating method to plate palladium film. The composition of the palladium plating solution is: 5g / L PdCl 2 , 500ml / L concentrated ammo...

Embodiment 2

[0028] (1). The preparation of the activation solution is the same as that in Example 1 (1). But the palladium source was changed to 0.5g of Pd(NO 3 ) 2 , the lye is 10ml of 2M KOH solution, and finally a stable colloid with a pH value of 5 is obtained, wherein the palladium content is 0.05mol / L.

[0029] (2).Activation: Immerse the washed and dried porous glass substrate in Pd(OH) 2 Take out the suspension when the surface turns orange and the color distribution is relatively uniform, and dry at 120°C. After taking it out and cooling to room temperature, put it into 0.1M N at a temperature of 70°C 2 h 4 Restore in the solution for 5 minutes, take it out, and wash away the substances with poor surface adhesion with water.

[0030] (3). The electroless plating method prepares the palladium film with embodiment 1 (3).

[0031] The palladium film prepared after the activation of this method has fewer defects than that of the traditional method (as shown by the ○ curve in FI...

Embodiment 3

[0033] (1). After corroding the dense glass carrier with hydrofluoric acid, it is cleaned and dried.

[0034] (2). The preparation of activation solution, the activation of matrix, and the method for electroless palladium plating are the same as embodiment 1 (1), (2). However, the palladium source was changed to 0.1g of PdCl during activation 2 , the lye is 40ml of 1M NaOH solution, and the palladium content in the colloid is 0.007mol / L. with H 2 During reduction, the temperature is 200°C and the time is 0.5h.

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Abstract

The present invention relates to a new colloid palladium activation technology used for non-metal substrate chemical plating to obtain homogeneous metal plating. Said particular technical project in accordance with the present invention is as follows: immerging the substrate pretreated into palladium hydroxide colloid activation liquid, drying the substrate after being taken out, then deoxidizing the palladium hydroxide at the surface of the substrate to deposite a layer of microparticles of metallic state Pd on the surface of the substrate, achieving the goal of activation. The present invention is especially suitable for chemical plating pre-activation of transient metals such as Pd, nickel, silver, cuprum and the like, resulting in more stability of prepared metal membranes at high-temperature and peeling avoidance. The present invention possesses wider practicability and more convenient operations, and is especially suitable for activation of porous non-metal substrate.

Description

technical field [0001] The invention relates to a new colloidal palladium activation technology, which is used for electroless plating of non-metallic substrates to obtain uniform metal coatings. Background technique [0002] Electroless plating is also called electroless plating (Electroless-plating), auto-catalytic plating (auto-catalytic plating), its principle is to reduce the metal salt by chemical reaction and make the metal deposit on the substrate surface with catalytic activity. Metal surfaces generally have catalytic activity for electroless plating, while non-metal surfaces need to be activated, that is, some metal particles are pre-deposited on the surface as catalysts. In the electroless plating process, the metal produced by the reaction is first deposited on the metal particle catalyst, and the metal produced by the reaction can continue to catalyze the chemical reaction, so as to realize the growth, connection and thickening of the metal layer, and finally fo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C18/18C23C18/30
Inventor 黄彦范菁菁舒世立胡小娟
Owner 扬州华宇管件有限公司
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