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Resin composite copper foil, printed wiring board, and production process thereof

A printed circuit board and resin composite technology, applied in the direction of multilayer circuit manufacturing, printed circuit components, printed circuit secondary processing, etc., can solve problems such as heat resistance problems

Active Publication Date: 2007-08-01
MITSUBISHI GAS CHEM CO INC +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Copper-clad laminates using such copper foil with adhesive have problems in adhesive strength or heat resistance after moisture absorption

Method used

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  • Resin composite copper foil, printed wiring board, and production process thereof
  • Resin composite copper foil, printed wiring board, and production process thereof
  • Resin composite copper foil, printed wiring board, and production process thereof

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Embodiment Construction

[0025] [017]. The present inventors have made painstaking researches to overcome the above-mentioned problems of the conventional technology, and found that using a polyimide containing a specific block copolymer and a specific horsepower formed on one surface of the copper foil Copper-clad laminates with excellent adhesive strength and heat resistance can be obtained by using a resin-composited copper foil with a resin layer of an imide compound. Based on the above findings, the present inventors have accomplished the present invention. That is, the present invention provides a resin composite copper foil comprising a copper foil and a resin layer containing a block copolymer polyimide and a maleimide compound, the resin layer being formed on one surface of the copper foil. The block copolymer polyimide is preferably a block copolymer polyimide having a structural unit represented by formula (1) and a structural unit represented by formula (2). The thickness of the resin lay...

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Abstract

A resin composite copper foil comprising a copper foil and a resin layer containing a block copolymer polyimide and a maleimide compound, the resin layer being formed on one surface of the copper foil, a production process thereof, a copper-clad laminate using the resin composite copper foil, a production process of a printed wiring board using the copper-clad laminate, and a printed wiring board obtained by the above process.

Description

technical field [0001] The present invention relates to the resin composite copper foil that is used for printed circuit board, the manufacturing method of resin composite copper foil, the copper-clad laminate that uses this resin composite copper foil, the printed circuit board that uses this copper-clad laminate, and The manufacturing method of the printed circuit board. The resin-composite copper foil obtained by the present invention has excellent adhesive strength, so that a copper foil having an extremely small surface roughness can be used. Copper-clad laminates using the above-mentioned resin-clad copper foil are suitable as high-density printed wiring boards containing fine circuits. In addition, the printed wiring board obtained by the method of the present invention has excellent copper plating adhesion strength or heat resistance, so the printed wiring board is suitable as a high-density printed wiring board containing fine circuits. Background technique [000...

Claims

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Application Information

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IPC IPC(8): H05K1/02H05K3/38H05K3/46B32B7/10
Inventor 野崎充岳杜夫田中泰夫永田英史菊地靖雄矢野真司
Owner MITSUBISHI GAS CHEM CO INC
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