Process for fabricating a leadless plastic chip carrier
a leadless plastic and chip carrier technology, applied in the direction of printed circuit manufacturing, printed circuit non-printed electric components association, basic electric elements, etc., can solve the problems of limiting the packaging density of such prior art devices, time-consuming and relatively expensive deposition of successive layers of metal, etc., and achieves material cost savings and robust three-dimensional structure
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first embodiment
[0023]Reference is made to FIGS. 1A to 1L which show the process for manufacturing a leadless plastic chip carrier (LPCC) according to the present invention. Referring first to FIG. 1A, an elevation view is provided of a first metal strip 18 that forms a part of the raw material of the leadframe strip (indicated generally by the numeral 20 in FIG. 1G). In the present embodiment, the metal strip 18 is a copper strip. As discussed in greater detail in Applicant's own U.S. Pat. No. 6,299,200, issued May 8, 2001, the contents of which are incorporated herein by reference, the leadframe strip 20 is divided into a plurality of sections. Each of the sections incorporates a plurality of leadframe units in an array (e.g. 3×3 array, 5×5 array, etc.). Only one such unit is depicted in the elevation views of the Figures, portions of adjacent units being shown by stippled lines.
[0024]The metal strip 18 is selectively plated with a preplating metal using plating resist to define the plating areas...
second embodiment
[0035]Reference is now made to FIGS. 2A–2O which show a process for manufacturing a Leadless Plastic Chip Carrier (LPCC), according to the invention. Referring to FIG. 2A, an elevation view is provided of a first metal strip 18 that forms a part of the raw material of the leadframe strip (indicated generally by the numeral 20 in FIG. 2F).
[0036]Referring to FIG. 2B, an elevation view is provided of a second metal strip 28 that forms a second part of the raw material of the leadframe strip 20. The second metal strip 28 is similar to the first metal strip 18 and therefore need not be further described herein. Similar to the first embodiment, the second copper strip 28 of the present embodiment is plated with tin (Sn) or solder on both upper and lower surfaces thereof (FIG. 2C). The coating serves to enhance lamination and etching resist.
[0037]Next, a solder flux is applied to the top, tin-plated surface of the second metal strip 28 (FIG. 2D). Alternatively, flux is applied to the botto...
third embodiment
[0042]Reference is now made to FIGS. 4A to 4M to describe a process for manufacturing a LPCC according to the present invention. Referring first to FIG. 4A, an elevation view is provided of a first metal strip 18 that forms part of the raw material of the leadframe strip (indicated generally by the numeral 20 in FIG. 4G). In the present embodiment, the metal strip 18 is a copper strip.
[0043]The metal strip 18 is selectively plated with a preplating metal using plating resist to define the plating areas. As previously described, the preplating metal is preferably silver (Ag), nickel and gold (Ni / Au) or nickel and palladium (Ni / Pd) (FIG. 4B). The preplating metal is selectively plated in a pattern of a power ring 24, and contact or I / O pads 26. Note that no ground ring is provided in the present embodiment.
[0044]Referring to FIG. 4C, an elevation view is provided of a second metal strip 28 that forms a second part of the raw material of the leadframe strip 20. In the present embodimen...
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