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Systems and methods for thermal management in inductors

a technology of inductance and thermal management, applied in the field of inductances, to achieve the effect of reducing the heat transfer rate and facilitating the flow of heat through the wall

Active Publication Date: 2021-09-23
HAMILTON SUNDSTRAND CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

This patent relates to a thermal management system that includes a housing with a groove and an aperture for a conductor to transfer heat. The conductor is a heat pipe with a greater heat transfer rate than the wall of the housing. The housing can be made using additive manufacturing. The technical effects of this system include efficient heat transfer, improved heat distribution, and improved manufacturing flexibility.

Problems solved by technology

Generally, heat is transferred to the heat sink using the potting material which generates large gradient between the heat generating components and heat sink due to lower thermal conductivity of the potting material.

Method used

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  • Systems and methods for thermal management in inductors
  • Systems and methods for thermal management in inductors
  • Systems and methods for thermal management in inductors

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Embodiment Construction

[0018]Reference will now be made to the drawings wherein like reference numerals identify similar structural features or aspects of the subject disclosure. For purposes of explanation and illustration, and not limitation, a partial view of an embodiment of a system in accordance with the disclosure is shown in FIG. 1 and is designated generally by reference character 100. Other embodiments of systems in accordance with the disclosure, or aspects thereof, are shown in FIGS. 1A-4 and described below. The systems and methods described herein provide for a thermal management system for an inductor assembly with improved thermal distribution across the inductor housing.

[0019]As shown in FIG. 1, a thermal management system 100 includes a toroidal inductor 101, a toroidal housing 102 around the toroidal inductor 101. The toroidal housing 102 is defined by an outer wall 104 and an inner wall 106. The housing 102 includes a top wall or lid 108. The toroidal inductor 101 includes a toroidal c...

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Abstract

A thermal management includes an inductor, a housing in thermal communication with the inductor, the housing defining a wall, and a conductor. The conductor has a greater heat transfer rate than the wall and is positioned within a groove and / or an aperture formed in the wall. The conductor is configured to transfer heat through the wall more efficiently than if the conductor were not present. A method of manufacturing a thermal management system includes forming a housing by additive manufacturing. The housing defines a wall having at least one of a groove and an aperture defined therein. The method includes positioning a conductor in at least one of the groove and the aperture. The conductor has a greater heat transfer rate than the wall. The method includes positioning an inductor into thermal communication with the housing.

Description

BACKGROUND1. Field[0001]The present disclosure relates to inductors, and more particularly to thermal management in inductor assemblies.2. Description of Related Art[0002]Inductors are important components in power electronics circuits. A variety of systems are used to create efficient thermal management in order to meet inductance requirements. The inductor generally includes a core and a wire winding wrapped or coiled around the core. The inductor is generally positioned within a metal housing. The wire winding needs to be spaced apart from the metal housing, the space between the winding and the metal housing is typically filled with potting material. The core material, potting material, and wire insulations for the windings generally have temperature limits. These temperature limits and other thermal requirements require efficient heat transfer from the heat-generating components (the core and wire winding), and / or a coolant used (which can sometimes be at high temperature, e.g....

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): H01F27/28H01F27/08H01F27/02H01F27/10H01F17/06
CPCH01F27/2876H01F27/085H01F27/2895H01F27/10H01F17/062H01F27/02H01F27/025Y02P10/25H01F41/04
Inventor JOSHI, ASHUTOSHPAL, DEBABRATA
Owner HAMILTON SUNDSTRAND CORP
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